II. Model Interpretation

PXI: Compliant with the PXI bus standard, 3U size, single slot, compatible with PXI/PXIe chassis.

5441: NI 5400 series number, meaning as follows:

54xx: Arbitrary waveform/function generator series;

x4x: Analog output model with **on-board signal processing (OSP)**;

xx41: 1-channel, 16-bit, 100 MS/s, 43 MHz bandwidth basic OSP model.

Component number (based on on-board memory):

779058‑01: 8 MB

779058‑02: 32 MB

779058‑03: 256 MB

779058‑04: 512 MB (top configuration)

III. Technical Parameters (25℃, 50 Ω load, typical values)

1. Basic Performance

Number of channels: 1 analog output

Resolution: 16-bit DAC

Sampling rate: 100 MS/s (external clock up to 105 MHz)

Interpolation capability: 2/4/8 times interpolation, equivalent up to 800 MS/s

Bandwidth (–3 dB): sine wave 43 MHz, square wave 25 MHz, triangle wave 5 MHz

Output amplitude:

High gain: 12 Vpp (±6 V) @ 50 Ω;

Direct connection (IF optimization): 0.707–1 Vpp;

Attenuation range: 0–51 dB (software adjustable).

Output impedance: 50 Ω/75 Ω (software selectable)

Frequency resolution: 0.355 μHz (DDS phase continuous)

SFDR: –91 dBc @ 10 MHz (low spurious)

THD: –67 dBc @ 10 MHz

2. On-board Signal Processing (OSP)

Interpolation filtering: FIR/CIC 2/4/8 times interpolation

Digital up-conversion: NCO + I/Q mixing, directly generating RF/IF signals

Digital gain / offset: Precisely adjustable in digital domain

Analog filter: 7th order elliptic low-pass (optional enable)

3. Storage and Synchronization

Waveform memory: 8/32/256/512 MB (optional)

Synchronization accuracy: < 20 ps RMS skew between multiple modules (NI-TClk)

Trigger / Clock: PXI trigger bus, REF IN/OUT (10 MHz), PFI programmable trigger I/O

4. Physical and Environment

Size: 3U single slot (approx. 160×100 mm)

Power consumption: approximately 21 W

Operating temperature: 0–55℃

Cooling: Forced air cooling (chassis fan)

IV. Interface and Communication Configuration

1. Front Panel (4×SMB + optional VHDCI) NI

CH0 (SMB): Analog output, default 50 Ω

CLK IN (SMB): External reference / sampling clock input (1–105 MHz)

PFI0/PFI1 (SMB): Programmable trigger I/O, clock routing

DIGITAL DATA & CONTROL (optional 68-pin VHDCI): 16-bit LVDS digital pattern output (high-end version) NI

2. Bus and System Interface

PXI backplane: 32-bit PCI, PXI trigger bus (TRIG0–TRIG6), star trigger

Data transfer: PCI bus, waveform download rate up to 100 MB/s

Synchronization clock: Internal 10 MHz reference, can be routed to PFI, trigger bus; supports PLL lock external 10 MHz clock

3. Software Driver Driver: NI-FGEN 2.2.1+ (standard)

Supported environments: LabVIEW, TestStand, Python, C#, LabWindows/CVI

Configuration tools: NI MAX, Soft Front Panel (SFP), NI Analog Waveform Editor

VII. Core Functions

On-board OSP signal processing: Integrated I/Q mixing, NCO, interpolation filtering, no need for host real-time calculation, directly generating intermediate frequency / baseband communication signals.

16-bit high resolution + high purity: -91 dBc SFDR, low spurious, high dynamic range, suitable for radar and military measurement strict requirements.

Dual output path design:

High gain path: 12 Vpp, general testing;

Direct connection path: 1 Vpp, IF optimization, low noise output.

Super large onboard memory: up to 512 MB, supports long waveforms, complex sequences, continuous data stream output.

ps-level multi-card synchronization: SMC architecture + NI-TClk, multi-module synchronization accuracy < 20 ps, suitable for MIMO, multi-channel radar / communication testing.

Mixed signal testing capability: High-end version with 16-bit LVDS digital output, synchronous output of analog + digital signals, suitable for ADC/DAC verification and high-speed interface testing.

VIII. Application Scenarios

Communication equipment testing: 4G/5G baseband / intermediate frequency signal simulation, QPSK/QAM modulation, receiver sensitivity and anti-interference testing.

Radar / Electronic Warfare: Radar intermediate frequency, pulse train, linear frequency modulation (LFM) signal simulation, electronic countermeasure signal simulation.

Semiconductor testing: High-speed ADC/DAC verification, mixed signal ATE, precise amplifier / filter testing, power management chip (PMIC) excitation.

Aerospace / Defense: Low spurious high-stability signal source, sensor simulation, military electronic equipment timing and function testing.

Automotive Electronics: ECU precise excitation, ADAS radar signal simulation, vehicle network timing verification.

IX. Usage and Maintenance Instructions

1. Installation and Power On

Power off installation, single slot fixed; chassis reliable grounding to prevent static electricity.

Power on preheating for 15 minutes, NI MAX self-check without hardware errors.

Keep ventilation during operation, temperature ≤ 55℃, avoid blocking the chassis fan.

2. Wiring and Operation

Signal output uses 50 Ω high-precision coaxial cable, SMB connector tightened to reduce signal reflection.

Output supports short-circuit protection (long-term grounding does not damage), but it is recommended to match 50 Ω/75 Ω load.

High frequency (>1 MHz) priority AC coupling; amplitude setting does not exceed 12 Vpp.

Multi-card synchronization: share 10 MHz reference clock, enable NI-TClk, ensure phase coherence.

3. Calibration and Maintenance

Calibration cycle: recommended 2-year 1-time NIST traceable calibration; daily use internal self-calibration to compensate temperature drift.

Interface maintenance: regularly clean SMB/VHDCI interface, keep dry; install dust cap for long-term idle.

Environmental requirements: no condensation, humidity 10%–90% RH; away from strong electromagnetic interference and vibration sources.

Prohibited operations: power-on insertion and removal of cables, severe vibration, overheating operation, interface overload.