Model Nomenclature

• PXI: Compliant with PXI (PCI eXtensions for Instrumentation) modular instrumentation bus.

• 8106: Controller series identifier; 81xx denotes PXI embedded controllers, 06 indicates the high‑end dual‑core model in the series.

• Full meaning: PXI bus, 81xx series, high‑performance dual‑core embedded controller.

Technical Specifications

• Form factor: 3U, 2‑slot PXI module.

• Part number: 779919‑00 (standard), 779919‑01 (RT flash).

• Processor: Intel Core 2 Duo T7400, 2.16 GHz dual‑core, 667 MHz FSB.

• Memory: 512 MB DDR2 667 MHz (max 4 GB).

• Storage: 30 GB+ HDD (standard); 4 GB+ flash (RT version).

• PXI bandwidth: Up to 132 MB/s system/slot.

• Power consumption: ~22 W (from PXI backplane).

• Operating temperature: 0 °C to 55 °C.

• Storage temperature: −40 °C to 71 °C.

• OS support: Windows XP/Vista/7, NI Real‑Time OS (dual‑boot capable).

• Video: DVI‑I (digital + analog).

• Serial: 1 × RS‑232.

• Parallel: 1 × IEEE 1284 ECP/EPP.

• USB: 4 × Hi‑Speed USB 2.0.

• Ethernet: 1 × Gigabit Ethernet (10/100/1000BASE‑TX).

• Expansion: ExpressCard/34 slot.

• Instrument control: Integrated GPIB (IEEE 488) controller.

• Front panel: Reset button, PXI trigger I/O, watchdog timer.

Interface and Communication Configuration

• PXI/CompactPCI interface: System controller slot, supports PXI trigger and RTSI synchronization buses.

• DMA: Integrated bus mastering for high‑speed data transfer between PXI modules and system memory.

• Drivers: NI‑PXI, NI‑DAQmx, NI‑VISA, NI‑GPIB.

• Programming environments: LabVIEW, LabWindows/CVI, C/C++, .NET.

• Communication protocols: TCP/IP, UDP, Modbus, CAN, GPIB, serial.

Core Features

1. High‑Performance Dual‑Core Processing

   The 2.16 GHz Core 2 Duo enables efficient multitasking, parallel signal processing, and complex algorithm execution, delivering 29% better performance than the PXI‑8105.
2. Rich Integrated Peripheral I/O

   DVI‑I, 4×USB 2.0, Gigabit Ethernet, GPIB, RS‑232, and ExpressCard/34 provide full connectivity for displays, peripherals, instruments, and expansion.
3. Dual‑Boot Real‑Time Capability

   Supports Windows + LabVIEW Real‑Time OS dual boot, switching between general‑purpose and deterministic real‑time operation for control and test applications.
4. High‑Speed PXI Data Transfer

   Up to 132 MB/s PXI bandwidth ensures fast data acquisition, signal processing, and multi‑module synchronization.
5. Rugged and Portable Design

   Compact 3U form factor, industrial temperature range, and backplane‑powered operation suit mobile, field, and industrial environments.

Applications

1. High‑Speed Automated Test Equipment (ATE)

   Semiconductor test, functional test of complex electronic assemblies, and high‑volume production test systems.
2. Real‑Time Data Acquisition and Processing

   High‑speed data logging, dynamic signal analysis, and multi‑sensor fusion in industrial and research settings.
3. Industrial Control and Embedded Systems

   High‑speed machine control, process monitoring, and embedded controller for real‑time machinery and automation.
4. Aerospace and Defense

   Avionics full‑interface test, radar signal processing, and ruggedized field test systems requiring high reliability.
5. Portable/Field Test Systems

   Compact, battery‑powered PXI systems for on‑site maintenance, vehicle diagnostics, and remote monitoring.

Usage and Maintenance

• Install in a standard 3U PXI chassis, occupying 1 system slot + 1 expansion slot.

• Power supplied exclusively via PXI backplane; ensure chassis provides ≥25 W per slot.

• Connect peripherals (monitor, keyboard, network, instruments) to front‑panel I/O before power‑on.

• For Windows: Install NI‑PXI, NI‑DAQmx, NI‑GPIB, and application software (LabVIEW, etc.).

• For Real‑Time: Use NI MAX to deploy RT OS to flash and configure network/boot settings.

• Configure BIOS (access via front‑panel reset during boot) for boot order and hardware settings.

• Operating temperature: 0 °C to 55 °C. Maintain chassis airflow; avoid blocking fan vents.

• Humidity: 10%–90% RH (non‑condensing). Keep in dry, dust‑free environment.

• Clean front‑panel connectors and chassis filters quarterly (power off, use dry cloth).

• Storage issues: Check HDD/SSD health via OS tools; RT flash corruption requires OS redeployment.

• Boot failures: Verify PXI backplane power, reseat controller, or reset BIOS defaults.

• Long‑term storage: Power off and store in dry area; power on for 1 hour monthly to prevent moisture damage.

• For indoor industrial use only, altitude ≤2000 m, pollution degree 2.

• Dispose of electronic waste per local regulations; do not discard in general trash。