PXI-5152
May 27, 2026

PXI-5152

Product Introduction The PXI-5152 is a 3U PXI hybrid bus high-speed dual-channel oscilloscope/digital instrument launched by the US company NI. It emphasizes ultra-high sampling rate, wide bandwidth, and is suitable for testing of high-speed transient and repetitive signals. It integrates 2 channels of synchronous analog input, 8-bit ADC, 2 GS/s real-time sampling rate, 300 MHz analog bandwidth, equivalent time sampling up to 20 GS/s, and each channel has onboard memory options of 8/64/256 MB. It is specifically designed for high-speed digital, RF, semiconductor, and nanosecond-level edge signal acquisition, and is the mainstream model for high-speed automated testing on the PXI platform.

Description

Model Explanation

PXI: Standard 3U PXI hybrid bus module, single slot, compatible with PXI/PXIe chassis.

5152: NI 5100 series number, representing 2 channels, 300 MHz bandwidth, 2 GS/s, 8 bits, high-speed PXI oscilloscope.

Component Number (by memory):

779772‑01: 8 MB / channel

779772‑02: 64 MB / channel

779772‑03: 256 MB / channel

Technical Parameters (25℃, preheating 15 min):

Channels: 2 analog inputs, full channel synchronous sampling.

Resolution: 8 bits.

Sampling Rate: Real-time 2 GS/s; equivalent time sampling up to 20 GS/s (repetitive signal).

Analog Bandwidth: 300 MHz (‑3 dB).

Input Voltage Range: ±100 mV to ±5 V (multiple levels, 200 mVpp to 10 Vpp).

Input Impedance: 50 Ω ±2% / 1 MΩ ±0.75% (software selectable).

Coupling Mode: AC/DC (per channel independently).

Onboard Memory: 8 MB / 64 MB / 256 MB (per channel).

Rise Time: ≤1.17 ns (50 Ω, 10%–90%).

Trigger Mode: Edge, Window, Hold, Digital, Immediate, Software Trigger; 5 ps time resolution; pre-trigger / post-trigger.

Clock: Internal 2 GHz VCSO; external 10–200 MHz sampling clock; lock-in PXI 10 MHz reference.

Power Consumption: Approximately 22 W.

Size / Weight: 3U single slot, approximately 480 g.

Environment: Operating 0–55℃; storage -40–70℃; humidity 10%–90% RH (no condensation).

Interface and Communication Configuration

Front-end Interface

2×BNC: CH0–CH1 analog input.

1×BNC (TRIG): external analog trigger input.

1×SMB (CLK IN): external sampling clock / reference input.

1×SMB (CLK OUT): internal clock / reference output.

2×SMB (PFI0/PFI1): digital trigger I/O, programmable function interface.

Panel Indicator Lights

PWR (green): normal power supply.

RUN (green): active when collecting, flashes when waiting for trigger.

ERR (red): over-temperature, over-current or configuration error.

Bus and Synchronization

PXI hybrid bus, supports PXI trigger bus, Star trigger, RTSI synchronization.

Multi-module synchronization phase error < 50 ps, scalable multi-channel high-speed synchronous acquisition.

Software Driver

NI‑SCOPE driver, supports LabVIEW, TestStand, Python, C#.

NI MAX: device identification, self-check, configuration, calibration.

Companion: soft front panel SFP, high-speed waveform analysis functions, streaming disk storage support. Core function

2 GS/s real-time + 20 GS/s equivalent sampling: Captures nanosecond-level edges and high-speed transient signals, suitable for ultra-high-resolution sampling of repetitive signals.

300 MHz bandwidth input: Covers high-frequency digital, RF, and ultrasound signals, meeting the requirements of high-speed communication and semiconductor testing.

Large-capacity deep storage: Up to 256 MB/channel, supports long-term high-speed waveform recording and multi-segment acquisition.

Flexible input configuration: Each channel can be AC/DC coupled, have 50 Ω/1 MΩ impedance, and multiple voltage ranges are selectable.

Precise triggering and 5 ps time resolution: Multiple triggering modes, accurately captures high-speed transient events and timing measurements.

High-speed streaming acquisition: Supports continuous data transmission and storage, suitable for long-term high-speed signal monitoring.

Multi-module synchronous expansion: PXI/RTSI/Star trigger synchronization, builds a multi-channel phase-coherent high-speed acquisition system. Applicable scenarios

High-speed digital testing: Timing and level tests for digital circuits, FPGA, and high-speed interfaces (USB3/PCIe).

Radio frequency and communication: Time-domain/frequency-domain analysis of 300 MHz and below radio frequency signals, modulation signals, and pulse signals.

Semiconductor testing: Chip transient characteristics, pulse signals, and high-speed acquisition of process parameters.

Ultrasonic and non-destructive testing: High-frequency ultrasonic echoes and imaging signals are collected and analyzed at high speed.

Automotive electronics: High-speed sensors, radar signals, and high-speed network testing for vehicles.

Research and defense: Pulse lasers, high-speed physical phenomena, and transient electromagnetic signal capture.

User and maintenance instructions

Installation and power-on

Power off for installation, insert into a single slot and fix; the chassis should be reliably grounded to prevent static electricity.

Power on for 15 minutes for preheating, and perform NI MAX self-check to confirm no hardware errors.

Keep the chassis ventilated during operation, with the environmental temperature ≤ 55°C, and avoid blocking the fan.

Wiring and operation

Use 50 Ω coaxial cables for high-frequency/high-speed signals, tighten the BNC connector to reduce signal reflection and loss.

Select 50 Ω impedance for high-frequency/radio frequency signals, 1 MΩ for low-frequency/high-voltage signals.

Use AC coupling for AC small signals, DC coupling for DC/low-voltage signals.

Prioritize using signals within the channel as trigger sources, set appropriate trigger levels to avoid false triggering; use edge triggering for high-speed signals.

Use PXI Star triggering for synchronous use of multiple modules to ensure ps-level phase consistency.

Maintenance and calibration

It is recommended to perform NIST traceable calibration once every 2 years; use internal self-calibration to compensate for temperature drift and time base errors in daily use.

Regularly clean dust from BNC/SMB interfaces to keep them dry; add a dust cap when the equipment is idle for a long time.

The working environment should be free of condensation, with a humidity of 10%–90% RH, and away from strong electromagnetic interference and vibration.

Do not input >±6 V voltage; do not plug or unplug cables while powered on; avoid severe vibration and impact.


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