Model Nomenclature

• PXIe: PXI Express high‑speed modular instrumentation bus

• 41: Precision SMU product line

• 45: 4‑channel, ±6 V/±500 mA, 15 pA sensitivity, high‑speed sequencing and enhanced low‑current performance

Technical Specifications

• Form factor: 3U single‑slot PXIe module

• Channels: 4 independent, bank‑isolated from earth ground (common LO)NI

• Voltage range: ±6 V, min step 0.1 mV

• Current range: ±500 mA, six auto‑ranging scales (500 mA / 100 mA / 10 mA / 1 mA / 100 µA / 10 µA)

• Power: 3 W sink/source per channel

• Current sensitivity: 15 pA (10 µA range)

• Sampling rate: up to 600 kS/s (V/I simultaneous)

• Update rate: up to 100 kS/s

• Voltage accuracy: ±0.015% reading + 50 µV

• Current accuracy: ±0.025% reading + 15 pA (10 µA range)

• Remote sense: 4‑wire with guard, programmable output impedanceNI

• Protection: OVP, OCP, reverse polarity, overtemperature

• Operating temperature: 0 °C to 55 °C (18 °C to 28 °C for rated accuracy)

• Storage temperature: −40 °C to 70 °C

• Connector: 25‑pin D‑Sub (male)NI

• Weight: approx. 410 g

Interface and Communication Configuration

• Bus: PXIe Gen1, Windows plug‑and‑play

• Driver: NI‑DCPower v1.7.5 or later

• Software: NI‑MAX, InstrumentStudio, LabVIEW, C/C++, Python

• Trigger: PXI trigger lines 0–7, multi‑module hardware synchronization

• I/O: Front‑panel 25‑pin D‑Sub for force, sense, and guard signalsNI

Core Features

• Four‑quadrant operation: bidirectional source/sink for active and passive devices

• 15 pA ultra‑high sensitivity: precise leakage and ultra‑low‑current measurements

• 500 mA high current drive: suitable for power transistors, PMICs, and battery testing

• SourceAdapt technology: adjustable transient response to minimize overshoot and ensure stability

• 4‑wire remote sense with guard: eliminates lead resistance and common‑mode errors in low‑current circuitsNI

• High‑speed sequencing: hardware‑timed IV sweeps, pulse tests, and parallel multi‑channel test flows

Application Scenarios

• Advanced power semiconductors: low‑voltage MOSFETs, FinFETs, and power diodes

• Precision analog and RF ICs: low‑leakage amplifiers, switches, and sensors

• PMICs and multi‑rail SoCs: high‑pin‑count ATE and parallel testing

• Low‑power and battery‑operated devices: ultra‑low‑current consumption validation

• MEMS and sensor characterization: picoamp‑level leakage and bias testing

Usage and Maintenance Instructions

Installation

Operation

Maintenance