Model Nomenclature

• PXIe: PXI Express high‑speed modular instrumentation bus.

• 41: Denotes the precision SMU series.

• 40: Indicates a 4‑channel, ±10 V, ±100 mA configuration with four‑quadrant operation, 100 pA sensitivity, and SourceAdapt technologyNI.

Technical Specifications

Basic Parameters

• Form Factor: 3U single‑slot PXIe module

• Channels: 4 independent channels (channel‑to‑ground isolation: 60 VDC, CAT I)NI

• Voltage Range: ±10 V (min. programmable step 0.1 mV)NI

• Current Range: ±100 mA, with 5 auto‑ranging scales: 100 mA / 10 mA / 1 mA / 100 µA / 10 µANI

• Power per Channel: 1 W (source/sink)

• Current Sensitivity: 100 pA (lowest range)NI

• Sampling Rate: Up to 600 kS/s (simultaneous V/I readback)NI

• Update Rate: Up to 100 kS/sNI

Electrical Performance

• Voltage Accuracy: ±0.02% of range + 20 µV

• Current Accuracy: ±0.03% of range + 100 pA (10 µA range)

• Remote Sense: 4‑wire with guard (eliminates wiring resistance errors)NI

• Output Impedance: Programmable (±1 V/range)

• Protection: Overvoltage, overcurrent, overtemperature, reverse polarity

Environmental & Mechanical

• Operating Temperature: 0 °C to 55 °C

• Storage Temperature: -40 °C to 70 °C

• Humidity: 10%–70% (non‑condensing, operating)

• Calibration Interval: 1 year (recommended)NI

• Connector: 25‑pin D‑Sub (male) for all channels

• Dimensions: 20 mm × 130 mm × 216 mm

• Weight: 425 g

Interface and Communication Configuration

• Bus: PXIe Gen1, plug‑and‑play for Windows

• Control Software: NI‑MAX (configuration), InstrumentStudio (interactive control)

• Programming Environments: LabVIEW, LabWindows/CVI, C++, Python (via NI‑DCPower driver)

• Triggering: PXI trigger lines 0–7 (hardware synchronization)

• Synchronization: Multi‑module triggering, sequence linking with other PXI instruments

• Isolation: 60 VDC channel‑to‑ground (CAT I) for floating measurementsNI

Core Features

• Four‑Quadrant Operation: Sources and sinks power (±10 V, ±100 mA) for true bi‑directional testingNI.

• 100 pA Sensitivity: Ultra‑low current measurement for leakage, sub‑threshold, and nano‑device characterizationNI.

• SourceAdapt Technology: Programmable transient response to stabilize any load, minimize overshoot, and protect DUTs.

• 4‑Wire Remote Sense with Guard: Eliminates IR drop and common‑mode errors in high‑precision setupsNI.

• High‑Speed Sequencing: Hardware‑timed I‑V sweeps, pulse generation, and multi‑channel synchronization up to 100 kS/sNI.

• Multi‑Mode Operation: Single‑point, sequence, and advanced sequencing modes for flexible test flowsNI.

Application Scenarios

• Semiconductor Test: Characterizing MOSFETs, diodes, IGBTs, and power ICs (I‑V curves, leakage, breakdown).

• High‑Pin‑Count ATE: Testing SoCs, FPGAs, and multi‑channel components in PXI‑based automated systemsNI.

• Precision Component Test: Verifying resistors, capacitors, sensors, and MEMS devices with pA‑level sensitivity.

• Aerospace & Defense: Bi‑directional power and precision measurement for avionics and radar modules.

• Battery & Energy Storage: Testing low‑capacity cells, supercapacitors, and fuel cells (charge/discharge cycles).

Usage and Maintenance Instructions

Installation & Configuration

Daily Maintenance

Safety & Calibration