Model Nomenclature

• PXIe: PXI Express high‑speed modular instrumentation bus

• 25: NI switch/multiplexer product series

• 75: 196‑channel (1‑wire) / 95/98‑channel (2‑wire) electromechanical latching multiplexer, 20 MHz, 100 V, 1 A

Technical Specifications

• Form factor: 3U, 1‑slot PXIe (hybrid/peripheral slot compatible)

• Topology: 1‑wire 196×1 multiplexer; 2‑wire 95×1 or 98×1 multiplexer (software‑selectable)

• Relay type: Electromechanical latching (DPDT), gold‑plated contacts

• Number of channels: 196 (1‑wire), 95/98 (2‑wire)

• Bandwidth: DC to 20 MHz

• Maximum switching voltage: 100 VDC / 100 VAC (channel‑to‑channel/ground, CAT I)

• Maximum switching current: 1 A per channel

• Maximum switching power: 60 W DC / 62.5 VA AC (DC to 60 Hz)

• DC isolation resistance: >1 GΩ (channel‑to‑COM, 25 °C)

• Operate time: Typical 1 ms, max 3.4 ms

• Relay life: >10⁶ operations (rated conditions)

• Scan rate: 140 cycles/s

• Scan list depth: 32,000 steps (deterministic scanning)

• Operating temperature: 0 °C to 55 °C; storage: −20 °C to 70 °C

• Power consumption: 6 W @ 12 V, 2.5 W @ 3.3 V (PXIe)

• Dimensions: 21.6 × 2.0 × 13.0 cm; weight: ~680 g

Interface and Communication Configuration

• Front‑panel I/O: 1×LFH 200‑pin connector (for all channel/COM connections)

• Bus: PXIe Gen1, plug‑and‑play (compatible with PXI hybrid slots)

• Triggering: PXI trigger lines 0–7; input trigger min. pulse width 150 ns; output trigger pulse width 1–62 μs for multi‑module synchronization

• Software support: NI‑MAX for configuration; LabVIEW, LabWindows/CVI, C++ APIs with NI‑SWITCH driver; NI Switch Executive for advanced routing

• Compatibility: Windows OS, 3U PXI/PXIe chassis

Core Features

• Ultra‑high‑density multiplexing: 196 channels in one slot maximizes test system channel count while minimizing footprint.

• Software‑reconfigurable topology: Switch between 1‑wire (196‑ch) and 2‑wire (95/98‑ch) modes without hardware changes, adapting to diverse test needs.

• Latching relay design: Maintains state without continuous power, reducing power consumption and heat generation.

• Onboard relay counting: Tracks relay cycle count for predictive maintenance and ensures long‑term reliability.

• Deterministic hardware scanning: 32,000‑step scan list enables precise, repeatable automated test sequences at 140 cycles/s.

• High isolation & power handling: >1 GΩ isolation and 100 V / 1 A ratings support robust signal routing for medium‑power devices.

Application Scenarios

• Semiconductor parametric test: High‑channel‑count switching for wafer probing, IC characterization, and discrete component testing.

• Aerospace & defense electronics validation: Signal routing for avionics, radar, and military system functional testing.

• Industrial PCB & assembly test: High‑density routing for functional and in‑circuit testing of complex PCBs and electronic assemblies.

• Data acquisition systems: Multiplexing hundreds of sensor signals (voltage, current, resistance) to measurement instruments.

• Fault insertion & system validation: Simulating signal faults in embedded systems and automotive electronics.

Usage and Maintenance Instructions

Installation and Configuration

Daily Maintenance

Safety Notice