Model Nomenclature

• PXIe: PXI Express bus

• 25: Switch/matrix series

• 32B: 512‑crosspoint, reed‑relay matrix, 100 V / 0.5 A rating, enhanced bandwidth

Technical Specifications

• Form factor: 3U, 1‑slot PXIe (hybrid/peripheral slots)

• Crosspoints: 512 (1‑wire or 2‑wire)NI

• Topologies (software/accessory selectable)NI:

  • 1‑wire: 4×128, 8×64, 16×32, dual 4×64, dual 8×32, quad 4×32

  • 2‑wire: 4×64, 8×32, 16×16, dual 4×32

• Relay type: Reed, rhodium contacts

• Max switching voltage: 100 VDC, 100 Vp ACNI

• Max switching current: 0.5 A DCNI

• Bandwidth: ≥30 MHz (1‑wire), ≥25 MHz (2‑wire)

• Scan rate: 2,000 cycles/sNI

• On‑resistance: Typical <2 Ω

• Thermal EMF: <50 μV (1‑wire), <20 μV (2‑wire)

• Relay life: 1×10⁹ cycles (mechanical); 1×10⁷ cycles (low‑power electrical)

• Operating temp: 0 °C to 55 °C; storage: −20 °C to 70 °C

• Power: 10 W (+5 V), 2 W (+3.3 V)

• Dimensions: 18.5 × 2.0 × 13.0 cm; weight: 454 g

• Simultaneous relays: 64 (PXIe)

Interface and Communication

• Front panel: 2×150‑pin Samtec ERM8 series connectors for matrix I/O

• Bus: PXIe Gen1, triggers 0–7 for multi‑module syncNI

• Trigger: Hardware input, min pulse width 150 nsNI

• Software: NI‑MAX configurable; LabVIEW/CVI/C++ APIs; NI‑SWITCH / Switch Executive supportedNI

Core Features

• High density & flexibility: 512 crosspoints, 10+ topologies (1‑wire/2‑wire) via terminal blocksNI

• High voltage & speed: 100 VDC rating, 2,000 cycles/s scan rateNI

• Wide bandwidth: ≥25–30 MHz for high‑frequency signal routing

• Low thermal offset: <20–50 μV for precision low‑voltage measurements

• Long relay life: 1×10⁹ mechanical cycles for extended service life

• Relay health monitoring: Onboard counter for predictive maintenanceNI

• Deterministic scanning: Hardware triggers ensure precise, repeatable timingNI

• Expandable: Multi‑module expansion up to 4×256 (1‑wire) with TB‑264xB & R1616 cable

Application Scenarios

• Semiconductor parametric test (high‑channel, moderate‑voltage)NI

• Aerospace/defense high‑density signal routing

• Industrial sensor and low‑power device validation

• Automotive ECU and distributed I/O testing

• High‑channel‑count data acquisition & switching systems

Usage and Maintenance

Installation

Operation

Maintenance