PXIE-2515
Description
Model Nomenclature
PXIe: PXI Express high‑speed modular instrument bus.
25: Series identifier for switch/signal insertion modules.
15: High‑speed digital multiplexer variant with 35 channels, reed relays, and dual analog buses for parametric measurement.
Technical Specifications
Form factor: 3U, one‑slot PXIe.
Channels: 35 channels (32 signal + 3 analog bus).
Relay type: Reed, rhodium contacts.
Max switching voltage: 30 VDC.
Max switching current: 0.25 A DC per channel.
Switch bandwidth: 50 MHz.
On‑resistance: Typically <2 Ω per channel.
Switching time: Typical 100 μs (including settling).
Relay life: >10⁸ operations under rated conditions.
Operating temperature: 0 °C to 50 °C; storage: -40 °C to 70 °C.
Power consumption: 8.4 W (+12 V), 0.8 W (+3.3 V) via PXIe bus.
Dimensions: 21.6 cm × 2.0 cm × 13.0 cm; weight: 247 g.
Interface and Communication Configuration
Front panel: Two VHDCI female connectors for DUT and instrument I/O, two BNC female connectors for analog bus monitoring.
Bus: PXIe Gen1, PXI trigger lines 0–7 for multi‑module synchronization.
Trigger: Input pulse width ≥150 ns; output pulse width software‑programmable 1–62 μs.
Software: Plug‑and‑play for Windows; configurable in NI‑MAX; programmable via LabVIEW, LabWindows/CVI, C++ APIs; supported by NI‑SWITCH driverNI.
Core Features
High‑speed digital routing: 50 MHz bandwidth for DIO signal switching and insertion.
Parametric test capability: Dual analog buses enable SMU/DMM connection for DC parametric measurements on digital pins.
Multi‑instrument integration: Connect one high‑speed DIO device (e.g., NI 654x/655x) and up to two instruments simultaneously.
Reed relay reliability: Fast, low‑contact‑resistance switching with long operational lifeNI.
Impedance control: Matched signal paths minimize reflections in high‑speed digital test systems.
PXIe synchronization: Align switching sequences with other PXIe instruments for coordinated test flows.
Application Scenarios
Semiconductor digital IC and SoC parametric and functional test.
Aerospace and defense avionics digital I/O validation and fault insertion.
Industrial control and embedded system digital pin characterization.
Automotive ECU and infotainment digital interface testing.
High‑speed digital board test and boundary scan validation.
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