II. Model Interpretation

PXI: Standard PXI bus, compatible with PXIe hybrid slots.

2593: NI high-density RF multiplexer series code, representing a 16-channel 500 MHz 50Ω RF multiplexer.

Full name: PXI-2593 16-channel 500 MHz 50Ω PXI RF multiplexer switch module.

Topology (software configurable): 16×1 non-terminated multiplexer (default); dual 8×1 non-terminated multiplexers; dual 4×1 external terminated multiplexers; sparse matrix (custom channel combination).

III. Technical Parameters

(1) RF Core Characteristics

Frequency range: DC ~ 500 MHz (–3 dB).

Characteristic impedance: 50 Ω (full channel matching).

Insertion loss: Typical < 0.9 dB (DC~200 MHz); < 1.6 dB (200~500 MHz).

Channel isolation: Typical ≥ 80 dB (100 MHz).

Voltage Standing Wave Ratio (VSWR): Typical ≤ 1.4:1.

Channel skew: < 100 ps per 8 channel group.

Maximum RF power: 10 W/channel (continuous).

Maximum switching voltage: 150 VDC/150 Vrms (CAT I); channel-to-ground/channel-to-channel isolation 150 V.

(2) Switch and Relay Parameters

Relay type: Electromechanical RF relay, gold contacts, low contact resistance.

Channel count: 16 RF channels + 1 common terminal (COM).

Action time: Typical 2.4 ms, maximum 4.4 ms.

Mechanical life: 5×10⁷ times on-off (1 V/10 mA).

Electrical life: 1×10⁶ times (10 W/50 MHz).

Termination method: Default non-terminated; supports external 50Ω MCX terminators.

(3) Scanning and Triggering

Scanning list: Maximum 32000 programmable scanning sequences.

Full-channel scanning rate: Up to 200 times/second.

Trigger channel: Supports PXI backplane Trigger 0~Trigger 7 hardware trigger bus.

Minimum trigger pulse width: 150 ns (when digital filtering is disabled).

(4) Physical and Environmental Parameters

Form specification: Standard 3U PXI single-slot module, compatible with PXIe hybrid slots.

Front-end connector: 17 MCX push-on RF connectors (16 channels + 1 common terminal). 

Dimensions: 216 mm × 20 mm × 130 mm.

Weight: Approximately 0.33 kg.

Power supply: 3.3 V/5 V on PXI backplane; typical power consumption 1 W (3.3 V) + 3.5 W (5 V).

Operating temperature: 0 ℃ ~ 55 ℃.

Storage temperature: -20 ℃ ~ 70 ℃.

Relative humidity: 5% ~ 85%, no condensation.

IV. Interface and Topology Configuration

Front-end I/O Interface (MCX)

16×1 mode: 16 independent RF channels (CH0~CH15) → 1 common terminal (COM);

Dual 8×1 mode: divided into two groups (CH0~CH7, CH8~CH15), each group is independently 8×1 multiplexed;

Dual 4×1 termination mode: two groups of 4 channels, each group has a common terminal connected to a 50Ω terminator to reduce reflection.

Bus and Software Communication

Bus Interface: Standard PXI backplane, compatible with PXIe mixed slots, automatically acquires power, clock, and trigger.

Driver: Standard NI- SWITCH, compliant with IVI specifications.

Software Support: LabVIEW, TestStand, LabWindows/CVI, Python, etc.

Basic Functions: NI MAX can perform hardware recognition, topology configuration, channel status reading, scan editing, trigger configuration, and lifetime count query.

Synchronization Capability: PXI trigger bus realizes high-precision synchronous switching of multiple modules.

V. Core Functions

500 MHz Broadband RF Switching: Covers DC to 500 MHz, suitable for analog RF, high-speed digital, and clock signal routing.

50Ω Impedance Matching: Full-link 50Ω design, VSWR ≤ 1.4, reduces signal reflection and loss.

High Isolation Low Insertion Loss: 80 dB isolation + 0.9 dB insertion loss, ensures high-frequency signal integrity.

Flexible Topology Configuration: 16×1 / Dual 8×1 / Dual 4×1 termination, suitable for different testing scenarios NI.

10 W High Power Capacity: 10 W continuous RF power per channel, meets medium-power RF testing requirements.

Relay Life Monitoring: On-board counter records the number of on/off cycles, supports predictive maintenance.

High-density MCX Interface: 17 MCX connectors, small size, reliable connection, simplifies high-frequency wiring.

VI. Application Scenarios

RF Communication Testing: Wireless transceivers, RF modules, multi-channel antenna switching, signal routing.

Semiconductor Testing: High-speed digital chips, RF ICs, clock distribution, ATE high-frequency testing system.

High-speed Digital Testing: DDR, PCIe, USB, etc. high-speed signal channel switching and verification.

General High-frequency Testing: Multi-channel switching of signals within 500 MHz source, oscilloscope, spectrum analyzer.

RF Aging Testing: Long-term stability testing of medium-power RF components, multi-channel parallel aging.

VII. Usage and Maintenance Instructions

Key Points of Use

Installation: Insert into 3U standard slot, tighten the panel screws, keep away from strong electromagnetic interference; PXIe chassis prefer mixed slots.

Cabling: Use 50Ω MCX RF cables, ensure the connectors are tightened to avoid VSWR deterioration; minimize the length of the high-frequency signal path.

Electrical Limits: Strictly follow the 150 V/10 W rated parameters; avoid electrostatic discharge (ESD), ground for anti-static before operation.

Topology Selection: Terminal mode is preferred for long-distance transmission or high-frequency scenarios; Dual 8×1 mode is used for multi-channel parallel testing. Heat dissipation: Ensure good ventilation of the case. Avoid overheating when operating at 500 MHz with high power.

Maintenance instructions

Regular inspection: Check MCX connectors every quarter, clean dust, check for loose oxidation, and focus on inspecting contact resistance for high-frequency connectors.

Life management: Regularly read the number of on/off cycles. Plan for replacing relays in advance when approaching the electrical lifespan limit.

Environmental control: Maintain dryness and ventilation. Temperature should be between 0 and 55 ℃. Avoid condensation and dust accumulation.

Fault handling: Check wiring, grounding, and VSWR first for abnormal channels; replace relays on-site for single-channel faults.

Storage requirements: Disconnect cables when in long-term inactivity, protect interfaces from dust, and store in a dry environment between -20 and 70 ℃.

Calibration: It is recommended to calibrate once a year to test insertion loss, isolation, VSWR, and channel consistency.