Model Explanation

PXI: PXI bus platform (modular instrument standard)

2536: Product serial number, representing 544 cross-point FET high-density matrix switch

Alias: NI-2536, PXI-2536 (FET 8×68 matrix)

Function Positioning: 8×68 single-line high-density matrix, FET without contact, ultra-high-speed, long-life signal routing NI

Technical Parameters

Cross-point Number: 544 (fixed 8 rows × 68 columns single-line matrix) NI

Relay Type: Field Effect Transistor (FET), no mechanical lifespan limit NI

Maximum Switching Voltage: ±12 VDC / 8 VACrms

Maximum Switching Current: 100 mA / channel

Maximum Switching Power: 1.2 W (single channel)

Bandwidth (–3 dB, 50 Ω): Typical 1 MHz

Thermal Emissivity: Typical < 5 μV

Channel Isolation Resistance: Typical > 1 GΩ (DC)

Path Resistance: Typical < 5 Ω (row to column)

Switching Time: Typical < 20 μs NI

Scan Rate: 50,000 cross-points per second NI

Maximum Drive Capability: 544 FETs (fully closed)

Trigger Characteristics: PXI trigger line 0–7, minimum pulse width 70 ns; hardware synchronization

I/O Connectors: 4 68-pin VHDCI motherhead

Size: 3U PXI single slot (216 × 20 × 130 mm)

Weight: Approximately 250 g

Operating Temperature: 0–55 °C

Interface and Communication Configuration

PXI Bus Interface: Standard 3U PXI backplane connector, power supply, trigger, clock and communication

Front-end I/O Connectors: 4×68-pin VHDCI, high-density signal output

Terminal Block (optional): TB-2625, etc., supports screw terminals or ribbon cable connections

Control Communication: PXI bus, compatible with NI- SWITCH, MAX, LabVIEW, TestStand NI

Trigger Synchronization: Hardware trigger input/output, nanosecond-level synchronization, improves test throughput NI

Expansion Capability: Multi-module cascading, can be extended to larger matrix scale

Core Function

High-density 8×68 matrix: 544 cross-points, single-slot integration, saves chassis resources NI.

FET Contactless Technology: Infinite mechanical lifespan, 50,000 switching times per second ultra-high-speed switching, suitable for high-frequency mass production NI.

Low Thermal Emissivity and High Isolation: < 5 μV thermal offset, > 1 GΩ isolation, suitable for low-level precision measurement.

Overvoltage Fault Protection: Built-in FET protection circuit to prevent overvoltage damage, improves system stability.

Hardware Trigger and Deterministic Timing: Minimum trigger pulse width of 70 ns, precise synchronization of multiple instruments NI.

On-board Relay Counters: Real-time monitoring of switching times, predicts maintenance cycle NI. Applicable scenarios

Semiconductor testing: Wafer testing, chip parameter testing, aging screening, high-density high-frequency switching NI.

PCB / electronic manufacturing: Circuit board conduction test, functional verification, batch production test NI.

Precise low-level testing: Sensor signal acquisition, instrument calibration, low-voltage signal switching.

Automated test system (ATE): High-density, high-speed rate test scenarios, shorten test cycle NI.

Small and medium-sized signal routing: Multi-channel signal switching in laboratory / R&D environment, balancing density and cost.

User and maintenance instructions

Key usage points

Installation: Standard 3U PXI chassis single slot, lock the panel, ensure the backplane connector is reliably connected.

Configuration: Set channel mapping, trigger parameters and scan sequence through NI-SWITCH or MAX software NI.

Cabling: 4×68-pin VHDCI connect to TB-2625 terminal block; strictly follow the ±12 V/100 mA limit, avoid overload.

Operation monitoring: Use the onboard relay counting function to regularly read the switching times, evaluate the module status NI.

Environment: Working temperature 0–55 °C, avoid strong electromagnetic interference, dust and condensation; must be well grounded to prevent FET malfunction.

Maintenance instructions

Regular inspection: Check the connector tightness, whether the terminal block wiring is loose, and clean the surface dust every quarter.

Life management: FET has no mechanical lifespan, but need to monitor electrical stress to avoid long-term overpressure / overcurrent operation NI.

Fault diagnosis: When the channel is not working or the signal is abnormal, first check the wiring and grounding, then diagnose the FET status through software; avoid electrostatic damage to the module.

Storage: When not in use for a long time, power off and store in a dry, dust-proof environment, add a dust cap to the connector to prevent moisture and oxidation.