Model Explanation

PXI: PXI bus platform (modular instrument standard)

2535: Product serial number, representing 544 cross-point FET high-density matrix switch

Alias: NI-2535, PXI-2535 (FET 4×136 matrix)

Function Positioning: 4×136 single-line ultra-high-density matrix, FET without contact, ultra-high-speed, long-life signal routing

Technical Parameters

Cross-point Number: 544 (fixed 4 rows × 136 columns single-line matrix)

Relay Type: Field Effect Transistor (FET), no mechanical lifespan limit

Maximum Switching Voltage: ±12 VDC / 8 VACrms

Maximum Switching Current: 100 mA/channel

Maximum Switching Power: 1.2 W (single channel)

Bandwidth (–3 dB, 50 Ω): Typical 1 MHz

Thermal Emissivity: Typical <5 μV

Channel Isolation Resistance: Typical >1 GΩ (DC)

Path Resistance: Typical <5 Ω (row to column)

Switching Time: Typical <20 μs

Scanning Rate: 50,000 cross-points/second (far exceeding SSR module)

Maximum Drive Capability: 544 FETs (fully closed)

Trigger Characteristics: PXI trigger line 0–7, minimum pulse width 70 ns; hardware synchronization

I/O Connector: 68-pin male SCSI type

Size: 3U PXI single slot (216 × 20 × 130 mm)

Weight: Approximately 250 g

Operating Temperature: 0–55 °C

Interface and Communication Configuration

PXI Bus Interface: Standard 3U PXI backplane connector, power supply, trigger, clock and communication

Front-end I/O Connector: 68-pin male SCSI, high-density signal output

Terminal Block (optional): TB-2625, etc., supports screw terminals or ribbon cable connections

Control Communication: PXI bus, compatible with NI- SWITCH, MAX, LabVIEW, TestStand

Trigger Synchronization: Hardware trigger input/output, nanosecond-level synchronization, enhancing test throughput

Expansion Capability: Multi-module cascading (via SHC68-C68-S cable), scalable to larger matrix size NI Core function

Ultra-high density 4×136 matrix: 544 intersections, single-slot accommodation, saving chassis slot resources.

FET contactless technology: infinite mechanical lifespan, ultra-high-speed switching at 50,000 times/second, suitable for high-frequency mass production testing.

Low thermal potential and high isolation: <5 μV thermal offset, >1 GΩ isolation, suitable for low-level precise measurement.

Overvoltage fault protection: built-in FET protection circuit to prevent overvoltage damage, enhancing system stability.

Hardware triggering and deterministic timing: minimum trigger pulse width of 70 ns, precise synchronization of multiple instruments, improving test efficiency.

On-board channel diagnosis: real-time monitoring of channel status, rapid fault location, reducing downtime. Applicable scenarios

Semiconductor testing: Wafer testing, chip parameter testing, aging screening, high-density, high-frequency switching requirements.

PCB / Electronic manufacturing: Circuit board conduction testing, functional verification, batch production testing, multi-channel signal routing.

Precise low-level testing: Sensor signal acquisition, instrument calibration, low-voltage signal switching, low thermal offset requirements.

Automated test system (ATE): High-density, high-speed rate test scenarios, shorten test cycle, enhance production capacity.

Small and medium-sized signal routing: Multi-channel signal switching in laboratory / R&D environment, balance density and cost.

User and maintenance instructions

Key usage points

Installation: Standard 3U PXI chassis single slot, lock the panel, ensure the backplane connector is reliably connected.

Configuration: Set channel mapping, trigger parameters and scan sequence through NI-SWITCH or MAX software.

Cabling: Connect TB-2625 terminal block with 68-pin SCSI, then transfer to the tested device; strictly follow the ±12 V/100 mA limit, avoid overload.

Operation monitoring: Use software diagnostic function to monitor channel status in real time, regularly check connection stability.

Environment: Working temperature 0–55 °C, avoid strong electromagnetic interference, dust and condensation; must be well grounded to prevent FET malfunction.

Maintenance instructions

Regular inspection: Check connector tightness, terminal block wiring for looseness every quarter, clean surface dust.

Life management: FET has no mechanical lifespan, but need to monitor electrical stress to avoid long-term overpressure / overcurrent operation.

Fault troubleshooting: When channel不通 or signal abnormal， first check wiring and grounding， then diagnose FET status through software； avoid electrostatic damage to the module.

Storage： When not in use for a long time， power off and store in a dry， dust-proof environment， add a dust cap to the connector to prevent moisture oxidation.