PXI-2515
May 27, 2026

PXI-2515

I. Product Introduction The PXI-2515 is a 3U PXI hybrid bus high-speed digital signal insertion/fault injection unit (FIU) launched by National Instruments (NI), specifically designed for high-speed digital I/O (DIO) signal testing and HIL fault simulation. It offers 35 feed-through channels (32 signals + 3 dedicated ones), uses reed relays, supports 30 VDC, 0.25 A/channel, with a bandwidth of up to 50 MHz, and can simulate open circuits, ground/power short circuits, and pin-to-pin short circuits. It is suitable for high-speed digital buses, chip/module pin parameter testing, and reliability verification.

Description

II. Model Interpretation

PXI: PCI eXtensions for Instrumentation, compatible with PXI/PXIe hybrid slots.

2515: 2500 series (fault insertion / signal switch), 15 represents 35 channels, high-speed 50 MHz, low-power digital signal type.

Part Number: 778572-15 (PXI); 780587-15 (PXIe-2515).

Status: In stock (NI's mainstream high-speed digital test dedicated FIU).

III. Technical Parameters

Channel Configuration:

Pass-through channels: 35 (32 independent signal channels + 3 dedicated channels)

Fault Bus: 2 (Bus A/B, programmable as ground, power supply, reference voltage)

Topology: Each channel supports "direct connection / disconnection / short circuit to Bus A/B" four states

Electrical Characteristics:

Maximum switching voltage: 30 VDC

Maximum switching current: 0.25 A (per channel)

Maximum carrying current: 0.3 A (per channel)

Conduction Resistance: <1.5 Ω (typical)

Relay Type: Reed Relay (Reed)

Protection: Overcurrent, overvoltage, ESD protection

Dynamic Performance:

Bandwidth: 50 MHz

Minimum pulse width: 150 ns

Channel skew: <130 ps (typical)

Switching Time: <1 μs (typical)

Relay Life: 10^8 times (typical, resistive load)

Physical and Environmental:

Size: 3U PXI (100 mm × 160 mm)

Weight: Approximately 0.25 kg

Operating Temperature: 0–55 °C; Storage: −40–70 °C

Humidity: 10%–90% RH (no condensation)

IV. Interface and Communication Configuration

Host Interface: PXI hybrid bus (compatible with PXIe/PXI), supports hot plugging, plug-and-play.

Signal Interface:

DUT Interface: VHDCI 68-pin (test device end)

HSDIO Interface: VHDCI 68-pin (connected to NI high-speed DIO device)

Fault Bus: 2×BNC (Bus A/B, front panel)

Trigger and Synchronization:

PXI Trigger Line: 70 ns resolution, supports multi-module synchronization

Hardware Trigger: Adapted for HIL real-time timing and high-speed digital testing

Driver Software: Compatible with NI-SWITCH 4.0+, NI-DAQmx 9.0+, LabVIEW Real-Time, NI VeriStand, TestStand, C/C++/Python API.

V. Core Functions

High-speed Digital Fault Injection: 50 MHz bandwidth, 150 ns minimum pulse, compatible with SPI, I²C, CAN/LIN, LVDS, etc. high-speed digital bus fault simulation.

High-density Channels and Flexible Topology: 35 independent channels + 2 fault buses, each channel can be independently configured as direct connection / open circuit / short circuit, achieving complex fault combinations.

Precise Timing and Low Skew: <130 ps channel skew, suitable for high-speed digital pin parameter testing and timing-sensitive scenarios.

Reed Relay High Reliability: 10^8 life, low conduction resistance, high-speed switching, suitable for long-term automated testing and high-density switching applications.

HIL and Parameter Testing Integration: Combined with NI high-speed DIO/SMU/DMM, realizes digital pin open circuit / short circuit / leakage / withstand voltage testing and HIL real-time fault injection.

VI. Application Scenarios High-speed digital bus testing: Fault injection and robustness verification for automotive CAN/LIN, industrial SPI/I²C, communication LVDS and other buses.

Chip/module pin testing: Open/closed circuit/leakage/voltage endurance parameter testing for digital pins of MCU, FPGA, SoC, and vehicle ECU.

HIL hardware-in-the-loop testing: Digital I/O fault simulation and real-time system verification for aviation/automotive electronic controllers.

Semiconductor and electronic manufacturing testing: High-speed digital function testing and fault screening for wafers/chips/wafer cards.

Embedded system reliability verification: Digital interface fault tolerance testing for industrial control, medical equipment, and consumer electronics.

VII. Installation and Maintenance Instructions

Installation and Wiring:

Module: Power off and plug/unplug, insert into PXI/PXIe mixed slot, tighten the fixing screws.

Wiring: Connect the VHDCI interface to the DUT and HSDIO device according to channel definition, connect the fault bus (ground/power) using BNC, strictly avoid exceeding 30 V and 0.25 A.

Grounding: Reliable connection between the chassis and system ground, independent grounding of the fault bus, reducing high-frequency interference.

Software Configuration:

Install NI-SWITCH and NI-DAQmx drivers, NI-MAX recognizes the module, configure the fault bus mapping.

Programming: Call the switch VI in LabVIEW, or configure the real-time fault sequence in VeriStand, conduct timing tests with high-speed DIO devices.

Daily Maintenance:

Cleaning: Use a soft cloth to wipe the panel after power off, avoid liquid entering the VHDCI/BNC interface.

Environment: Working temperature 0–55 °C, avoid dust, moisture, and strong electromagnetic interference.

Protection Mechanism: Avoid overpressure (>30 V), overcurrent (>0.25 A), inductive loads (without surge suppression), extend relay lifespan.

Static Protection: Wear an anti-static wristband when plugging/unplugging the module, ensure good grounding of the chassis.


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