PXI-2547
May 27, 2026

PXI-2547

I. Product Introduction PXI-2547 is a 3U PXI single 8×1 (SP8T) electromechanical RF multiplexer produced by National Instruments (NI). It has an active status and the part number is 778572-47NI. The module uses electromechanical relays (EMR) and supports DC to 2.7 GHz, 50 Ω RF signal routing. It features high channel count, low loss, no built-in terminations, and is designed for medium-low frequency, multiple DUT, high-density production RF ATE systems, balancing cost and channel density. NI

Description

II. Model Interpretation

PXI: PXI Hybrid Bus (compatible with PXIe Hybrid Slot) NI

2547: Serial Number, representing 2.7 GHz, single 8×1, electromechanical RF multiplexer NI

Alias: NI-2547, 8x1 Mux, SP8T RF Switch NI

Function Positioning: Single group 8-select-1 RF switch, electromechanical low loss, no built-in terminal, high-density channels, preferred choice for multi-DUT testing NI

III. Technical Parameters Basic parameters

Topology: Single group 8×1 (SP8T) multiplexer, CH0 to CH7 → COMNI

Relay type: Electromechanical latch relay (EMR)

Frequency range: DC to 2.7 GHz (–3 dB) NI

Characteristic impedance: 50 Ω (nominal) NI

Terminal configuration: No built-in 50 Ω terminal (requires external terminal or matching load)

RF performance (typical / guaranteed values)

Insertion loss:

≤1 GHz: <1.05 dB (typical <0.7 dB)

≤2.7 GHz: <2.0 dB (typical <1.6 dB)

Isolation:

1 GHz: >50 dB NI

2.7 GHz: >40 dB NI

VSWR: <1.3 (within 2.7 GHz) NI

Maximum switching power: +24 dBm (continuous) NI

Terminal power: No built-in terminal, external load ≤ 1.5 W @25 °C

Electrical and dynamic

Maximum switching voltage: 30 VAC / 42 VDC

Maximum switching current: 0.5 A (per channel)

Switching time: Typical 5 ms (electromechanical)

Relay lifespan: 1,000,000 times (typical), onboard counter tracking NI

DC path resistance: Initial <0.25 Ω; end-of-life ≥1.0 Ω

Physical and environmental

I/O connector: RF 9×SMA female (8 channels + 1 common terminal, gold-plated)

Size: 3U PXI single slot (approx. 216×20×130 mm)

Weight: Approx. 255 g (9 oz)

Power consumption: 12 V ≈0.35 W

Operating temperature: 0 to 55 °C

Storage temperature: –40 to 70 °C

IV. Interface and Communication Configuration

Front-end interface

RF interface: 9×SMA female (gold-plated)

CH0 to CH7: 8-channel RF input

COM: Common output

Trigger interface: No independent trigger (supports PXI backplane hardware trigger) NI

Bus and control

Bus interface: Standard 3U PXI mixed bus (compatible with PXIe mixed slot) NI

Control software: Compatible with NI- SWITCH, MAX, LabVIEW, TestStand, Switch Executive NI

Driver support: NI-DAQmx, NI-VISA, provides VI and API function libraries NI

Trigger synchronization: PXI hardware trigger, nanosecond-level synchronization, supports multi-module cascading NI

Configuration method: Software sets channel mapping, scan sequence, relay count reading NI

Adaptation and expansion

Adaptation cable: SMA-SMA direct connection; optional SMA to BNC/SMB/MCX NI

Expansion capability: Multi-module cascading, expand channel quantity, build large-scale RF switch system NI

V. Core Functions

Single 8×1 high-density routing: 8-select-1 signal switching, 8-channel RF input per slot, significantly increase DUT test density, save chassis slots.

DC to 2.7 GHz wideband coverage: Covers Bluetooth, WiFi, ISM, 2G/3G, etc., mainstream medium and low-frequency RF frequency bands, suitable for consumer electronics and industrial RF testing NI.

Electromechanical relay low loss: Compared to solid-state, lower insertion loss, lower cost, suitable for scenarios with sensitive to loss and moderate switching frequency, mass production NI.

No built-in terminal design: Flexible adaptation to external matching load or terminal, suitable for scenarios requiring custom terminals or high-power routing.

Relay count: Onboard counter, real-time counts switching times, predicts lifespan, reduces unplanned downtime NI. PXI Standard Integration: Single-slot 3U size, seamlessly integrated with PXI chassis, compatible with automated test systems, supporting hardware-triggered synchronization NI.

Six. Application Scenarios

Consumer Electronics RF Testing: Bluetooth, WiFi, 2G/3G, NFC module function verification and mass production testing, multi-DUT parallel polling NI.

High-density Multi-channel RF Switching: Signal source / spectrum analyzer / network analyzer channel expansion, 8 DUTs sharing 1 instrument, reducing testing costs NI.

Mass Production ATE Testing: Cost-sensitive, medium-low frequency, medium switching times mass production line, single-slot achieving 8 channels, maximizing chassis utilization NI.

Research and Development Laboratory: RF signal routing, instrument interconnection, solution verification, low-loss design ensures test accuracy NI.

Semiconductor RF Chip Testing: Mid-low frequency RF IC function verification, parameter testing, aging screening, multi-chip parallel testing NI.

Seven. Usage and Maintenance Instructions

Usage Points

Installation: Standard 3U PXI single-slot, lock the panel, ensure reliable contact of the backplane; avoid strong vibration and electromagnetic interference NI.

Connection: SMA connectors are lightly inserted and removed, avoid violent operation; RF power ≤ +24 dBm,严禁 operating beyond power; unused channels are recommended to be connected to 50 Ω terminations.

Power-on Status: By default, all channels are disconnected from COM, no built-in terminal, external matching load is required to avoid reflection.

Software Control: Use NI- SWITCH or LabVIEW VI for Connect/Disconnect; regularly read relay counts NI.

Environment: 0 - 55 °C operating temperature, dust-proof, moisture-proof, and dew-proof; away from strong electromagnetic interference sources, ensure good grounding.

Maintenance Instructions

Regular Inspection: Check every quarter for any looseness, oxidation or damage of SMA connectors; clean the panel and ventilation ports, maintain good heat dissipation NI.

Life Management: Mechanical and electrical relays approximately 1 million times; regularly read onboard counters, plan for replacement in advance to avoid downtime NI.

Fault Troubleshooting: First check SMA connection, external terminal and grounding; use MAX diagnostic switch status; take precautions against static electricity to avoid module damage NI.

Storage: Power off when not in use, cover SMA connectors with dust caps, dry and dust-proof storage, avoid high temperature, high humidity and strong magnetic field environments NI.

Calibration: It is recommended to calibrate once a year to ensure that insertion loss, isolation, VSWR, etc. indicators meet specifications; contact NI or a third-party calibration institution NI.


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