Model Nomenclature

• PXIe: PXI Express high‑speed modular instrumentation bus

• 25: NI switch/relay product series

• 93: 16‑channel, 50 Ω, 500 MHz RF multiplexer, latching EMR, MCX/SMB I/O

Technical Specifications

• Form factor: 3U, 1‑slot PXIe (hybrid/peripheral slot compatible)

• Topology: Software‑selectable—16×1 mux, dual 8×1 mux, dual 4×1 terminated mux, or sparse matrixNI

• Relay type: Electromechanical latching (SPDT), silver‑palladium/gold contacts

• Number of channels: 16 (signal) + 2 (trigger/COM)

• Characteristic impedance: 50 Ω (nominal)NI

• Bandwidth: DC to 500 MHzNI

• Insertion loss: <0.9 dB (DC–200 MHz); <1.6 dB (200–500 MHz)

• Isolation: >60 dB @ 500 MHz (channel‑to‑channel)

• Maximum switching voltage: 150 VAC / 150 VDC (CAT I, channel‑to‑channel/ground)

• Maximum switching current: 0.5 A (per channel)

• Maximum RF carry power: 10 W (continuous, up to 500 MHz)

• Minimum switch load: 10 mV / 10 μA

• Operate time: Typical 2 ms; max 5 ms

• Relay life: >5×10⁵ operations (rated RF conditions)

• Triggering: PXI trigger lines 0–7; 2×SMB trigger/COM ports

• Operating temperature: 0 °C to 55 °C; storage: −20 °C to 70 °C

• Power consumption: 7 W @ 12 V, 3 W @ 3.3 V (PXIe)

• Dimensions: 21.6 × 2.0 × 13.0 cm; weight: ~700 g

Interface and Communication Configuration

• Front‑panel I/O: 18×MCX female (signal channels) + 2×SMB male (trigger/COM)

• Bus: PXIe Gen1, plug‑and‑play (compatible with PXI hybrid slots)

• Triggering: PXI trigger bus (0–7); SMB I/O for external triggering/synchronization

• Software support: NI‑MAX for configuration; LabVIEW, LabWindows/CVI, C++ APIs with NI‑SWITCH driver; NI Switch Executive for advanced routingNI

• Compatibility: Windows OS, 3U PXI/PXIe chassis

Core Features

• 500 MHz RF performance: Optimized for DC‑to‑500 MHz with low insertion loss and high isolation, ideal for RF and high‑speed digital signalsNI.

• Flexible software‑configurable topologies: Adapts to 16×1, dual 8×1, dual 4×1 terminated, or sparse matrix without hardware changesNI.

• Latching relay design: Maintains state without continuous power, reducing power draw and heat for long‑term reliability.

• High RF power handling: Supports up to 10 W continuous RF power for robust signal routing in high‑power test applications.

• Precision 50 Ω impedance matching: Ensures minimal signal reflection and optimal power transfer in RF systemsNI.

• Deterministic scanning: Supports hardware‑timed scan sequences for repeatable automated test workflows.

Application Scenarios

• Wireless device test: RF signal routing for 4G/5G modules, Bluetooth, Wi‑Fi, and IoT device validation.

• Semiconductor RF test: Characterization of RF transistors, amplifiers, switches, and ICs in wafer probing and package test.

• Aerospace & defense RF test: Signal switching for avionics, radar, and military communication systems up to 500 MHz.

• High‑speed digital test: Routing high‑speed digital signals (up to 500 MHz) for PCB and assembly functional test.

• RF ATE systems: High‑channel‑count RF routing for automated test equipment in manufacturing and validation labs.

Usage and Maintenance Instructions

Installation and Configuration

Daily Maintenance

Safety Notice