Model Nomenclature

• PXIe: PXI Express bus interface

• 25: NI switch/matrix product series

• 41: 8×12 RF matrix, 300 MHz, MCX connectors, 50 Ω systemNI

Technical Specifications

• Form factor: 3U, 1‑slot PXIe (hybrid/peripheral slot)

• Matrix topology: 8 rows × 12 columns = 96 crosspoints, non‑blocking

• Impedance: 50 Ω

• Frequency range: DC to 300 MHzNI

• Relay type: Non‑latching reed, rhodium‑plated contacts

• Switching voltage: 60 VDC / 42.4 Vpk AC

• Switching current: 0.5 A (AC/DC) per channel

• Switching power: Max 10 W DC per channel

• RF power: Max 10 W (50 Ω, derated with frequency/channels)

• Insertion loss: Typical <2.1 dB @ 300 MHz

• Isolation: >75 dB @ 300 MHz

• Scan rate: 100 cycles/s

• Relay life: >10⁷ operations (rated conditions)

• Operating temperature: 0 °C to 55 °C; storage: −20 °C to 70 °C

• Power consumption: 10 W @ 12 V, 2.5 W @ 3.3 V (PXIe)

• Dimensions: 21.6 × 2.0 × 13.0 cm; weight: 410 g

Interface and Communication Configuration

• Front‑panel I/O: 28×MCX female connectors (8 row + 12 column)

• Bus: PXIe Gen1, plug‑and‑playNI

• Triggering: PXI trigger lines 0–7, programmable pulse width (1 μs to 62 μs) for multi‑module synchronization

• Software support: NI‑MAX for configuration; LabVIEW, LabWindows/CVI, C++ APIs with NI‑SWITCH driverNI

• Compatibility: Windows OS, PXIe chassis (3U)NI

Core Features

• Full non‑blocking matrix: Any row connects to any column simultaneously for flexible, independent signal routingNI.

• High RF performance: Isolation relays disconnect unused paths, ensuring high isolation and low crosstalkNI.

• 50 Ω matched system: Optimized for RF signal integrity up to 300 MHz.

• Expandable: Cascades with other PXIe‑2541 modules to form 8×24, 8×36 or larger matricesNI.

• Long‑life reed relays: Rhodium contacts provide stable, reliable operation for mass‑production test systems.

• Deterministic hardware triggering: Enables precise, repeatable switching in automated sequences.

Application Scenarios

• Functional testing of wireless devices/modules up to 300 MHzNI.

• RF signal routing between signal generators, spectrum analyzers, digitizers and test instrumentsNI.

• Semiconductor RF parametric testing.

• Automotive electronics and industrial communication equipment verification.

• General‑purpose RF automated test systems requiring high‑density, non‑blocking switchingNI.

Usage and Maintenance Instructions

Installation and Configuration

Daily Maintenance

Safety Notice