Model Explanation

PXI: PXI bus platform

2541: Product serial number, representing an 8×12 RF matrix switch (350 MHz)

Alias: NI-2541, PXI-2541 (RF 8×12 matrix)

Function Positioning: 8 rows × 12 columns high-density RF matrix, reed relays, high isolation, cascading expansion NI

Technical Parameters

Topology Structure: 8×12 single-line matrix (96 cross points), non-blocking NI

Relay Type: Reed relay (Reed), magnetic retention

Frequency Range: DC to 350 MHz (–3 dB) NI

Characteristic Impedance: 50 Ω

Maximum Switching Voltage: 60 VDC

Maximum Switching Current: 500 mA/channel

Maximum Switching Power: 10 W (DC)

RF Power (350 MHz): Typical + 20 dBm

Insertion Loss: Typical < 2.1 dB (300 MHz)

Channel Isolation: Typical > 75 dB (300 MHz)

Return Loss: Typical > 18 dB (300 MHz)

Switching Time: Typical < 1 ms

Relay Lifespan: Typical 10⁸ times (resistive load)

I/O Connector: 20×MCX female (8 rows + 12 columns)

Size: 3U PXI single slot

Weight: Approximately 300 g

Operating Temperature: 0–55 °C

Interface and Communication Configuration

PXI Bus Interface: Standard 3U PXI backplane, power supply, trigger, clock, communication

Front-end I/O: 20 MCX female (R0–R7, C0–C11), including row expansion I/O (Row In/Out)

Adapter Cable: MCX-MCX direct connection; optional MCX to BNC/SMB/SMA

Control Software: Compatible with NI- SWITCH, MAX, LabVIEW, TestStand

Trigger Synchronization: 2 channels of PXI hardware trigger, nanosecond-level synchronization

Expansion Capability: Multi-module cascading (8×24, 8×36…), dedicated cascading cable NI

Core Function

8×12 Non-blocking RF Matrix: 96 cross points, any row/column can be simultaneously conductive, high test flexibility NI.

DC to 350 MHz wideband: Covers medium and low-frequency RF, analog and mixed signals NI.

High Isolation and Low Loss: > 75 dB isolation, < 2.1 dB insertion loss, ensuring signal integrity.

Magnetic Retaining Reed Relays: Low contact resistance, long lifespan (10⁸ times), low power consumption.

Hardware Trigger and Scanning: Nanosecond-level synchronization, high-speed sequence scanning, improving test throughput.

On-board Relay Counting: Real-time recording of switching times, predicting maintenance cycle. Applicable scenarios

Consumer electronics RF testing: Testing of low and medium frequency radio frequency functions such as Bluetooth, WiFi, NFC, and FM.

Semiconductor / chip testing: Parameter testing and aging screening of RF chips and mixed-signal ICs.

Communication module manufacturing: Calibration, functional verification, and multi-channel signal routing of RF modules.

ATE automated testing system: Reuse of instruments, multi-channel RF signal switching, cost reduction by NI.

Research and development laboratory: RF signal switching, instrument interconnection, signal distribution and routing.

User and maintenance instructions

Key usage points

Installation: Standard 3U PXI chassis single slot, lock the panel, ensure reliable contact of the backplane.

Configuration: NI-SWITCH/MAX set channel mapping, trigger parameters, scan sequence.

Connection: MCX connector should be inserted and removed gently; do not exceed pressure (60 VDC), current (500 mA), or power.

RF considerations: 50 Ω impedance matching; ensure good grounding, keep away from strong electromagnetic interference.

Environment: 0–55 °C, dust-proof, moisture-proof, condensation-proof; keep away from vibration sources.

Maintenance instructions

Regular inspection: Check the tightness of MCX connectors and for any looseness/oxidation every quarter; clean the surface dust.

Life management: Monitor the count of relays, evaluate replacement when approaching 10⁸ times; avoid long-term high power/high frequency switching.

Troubleshooting: First check the MCX connection and grounding for abnormal signals; use software to diagnose the relay status; take precautions against static electricity.

Storage: Power off when not in use, store in a dry, dust-proof environment, cover the connector with a dust cap to prevent moisture and oxidation.