XYCOM XVME-135 (VMEbus 3U Enhanced Storage Module)
May 21, 2026

XYCOM XVME-135 (VMEbus 3U Enhanced Storage Module)

XVME-135 is a 3U single-height VMEbus enhanced storage module launched by XYCOM (now part of Acromag). It is an upgraded version of XVME-103. Its core features include enhanced large-capacity Flash support, faster access speed, and more stable power-off protection. It is suitable for long-life industrial control, embedded systems, and harsh environment VME platforms.

Description

XYCOM XVME-135 (VMEbus 3U Enhanced Storage Module)

The XVME-135 is a 3U single-height VMEbus enhanced storage module launched by XYCOM (now part of Acromag). It is an upgraded version of XVME-103, featuring enhanced support for large-capacity Flash, faster access speed, and more stable power-off protection. It is suitable for long-life industrial control, embedded systems, and demanding industrial VME platforms. 

I. Model Positioning and Core Functionality

Positioning: 3U high-end storage module, an upgraded version of XVME-103, focusing on enhancing Flash capacity, read/write speed, and power stability, and compatible with all standard 3U VME enclosures and backplanes.

Core Functionality:

Large-capacity program storage: capable of handling large firmware, RTOS, and complex applications, prioritizing Flash (replacing EPROM), with fast erasing and long lifespan;

Critical data power-off protection: battery backup for RAM/Flash storage of process parameters, calibration data, and operation logs, permanently saved upon power loss;

Upgrade of old VME systems: directly replace XVME-100/103, no need to modify hardware or rewrite programs, achieving dual improvements in capacity and performance;

Military / Aviation high-reliability scenarios: wide temperature range, vibration resistance, long lifespan, meeting MIL-STD-810 standards.

II. Core Functional Characteristics

1. Standard 3U VMEbus interface, fully compatible

Complies with VMEbus IEEE 1014 (2.0/3.0), 3U single slot;

A24 address space, DTB slave device, compatible with all XYCOM series and third-party VME devices.

2. Dual storage groups, eight slots, large-capacity enhancement

2 groups (Bank1/Bank2) × 4 slots = 8 × 32-pin JEDEC;

Supported chips: CMOS RAM, EPROM, Flash (enhanced), EEPROM;

Maximum capacity: RAM 4MB, EPROM 8MB, Flash 8MB (XVME-103 is 4MB), EEPROM 4MB;

Speed: 50/100/150ns (XVME-103 minimum 100ns), compatible with high-speed timing;

Data width: 8/16 bits, supports RMW (read - modify - write).

3. Triple power-off protection, enhanced power supply monitoring

Built-in lithium battery: simultaneously backs up RAM and Flash configuration areas, seamless switching upon power loss;

Dual backup power sources: built-in battery or VME +5V STDBY (jumper selectable);

Undervoltage lockout: write operations disabled when +5V is below 4.75V, protecting data, self-check upon power-on and triggering BATT/FAIL alarms;

Battery low voltage indication: the BATT LED on the panel lights up when a battery replacement is needed.

4. Independent jumper configuration, flexible adaptation

Base address (A24), chip type / speed, backup power mode, write protection, SYSFAIL/SYSRESET linkage;

No need to modify hardware, jumper settings can adapt to different system planning.

5. Industrial-grade high reliability

Operating temperature: 0℃~+70℃ (XVME-103 is 65℃);

Storage temperature: -40℃~+85℃;

Vibration resistance: 1g (10–100Hz); shock resistance: 15g;

EMC: CE/FCC Class A, gold-plated gold fingers, shielding design;

Power consumption: +5V@1A (typical 5W), low heat generation.

6. Panel LED status indication

POWER: normal power always on;

BATT: battery low voltage alarm;

FAIL: power / battery / storage failure;

Bank1/Bank2 ACT: read/write flashing.

III. Hardware Specifications Overview

Bus and Interface

Standard: VMEbus IEEE 1014 (2.0/3.0)

Address: A24 (16MB)

Data width: 8/16 bits

Slots: 8×32-pin JEDEC, 2 independent

Storage Configuration Support: RAM, EPROM, Flash, EEPROM

Maximum capacity: RAM 4MB; EPROM 8MB; Flash 8MB; EEPROM 4MB

Speed: 50/100/150ns (cable)

Backup: Lithium battery / STDBY (optional)

Electrical / Environmental

Power supply: +5V DC ±5%, 1A (5W)

Operating temperature: 0℃~+70℃

Size: 3U (100×160mm), single slot

Weight: Approximately 0.35kg

IV. Key Differences (Upgrade Points) from XVME-103

Flash capacity: XVME-135 8MB; XVME-103 4MB

Access speed: XVME-135 minimum 50ns; XVME-103 minimum 100ns

Upper limit of operating temperature: XVME-135 70℃; XVME-103 65℃

Power stability: Enhanced monitoring, more reliable power-off protection for Flash configuration area

V. Application scenarios

Semiconductor / Industrial robots: 8MB Flash stores large firmware, high-speed read/write, reduces downtime;

Power / Chemical industry: Battery backup for storing process parameters and logs, no loss in power-off, traceable compliance;

Military / Aviation: Wide temperature range, shock resistance, long lifespan, suitable for onboard / radar / navigation control;

Upgrade of old VME: Replace XVME-100/103, capacity doubles, speed increases, lifespan extends.

VI. Installation and maintenance key points Installation

Case / Backplate Preparation: Confirm normal +5V and STDBY voltages;

Jumper Settings: Base address, chip speed, backup power mode;

Chip Installation: Insert in the specified direction to ensure good contact;

Board Insertion and Fixation; Power-on Self-Test: POWER light is constantly on, BATT light is off, FAIL light is off, read/write test is normal. Maintenance

Cleaning: Power off every 3 months to clean the circuit boards and gold fingers;

Battery: Check the BATT LED every 1 year. Replace with lithium battery if the voltage is low;

Configuration / Chips: Regularly check the jumpers and chips to prevent loosening / oxidation.

VII. Core Advantages

XVME-135 is the performance optimization for 3U VME storage: 8MB Flash, 50ns high speed, 70℃ wide temperature range, triple power-off protection, compatible with XVME-103. It addresses the pain points of traditional modules with small capacity, slow speed, and unstable high temperatures, has sufficient spare parts, high cost performance, and is suitable for building high-end VME systems and upgrading old equipment.


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