XYCOM XVME-135 (VMEbus 3U Enhanced Storage Module)
Description
XYCOM XVME-135 (VMEbus 3U Enhanced Storage Module)
The XVME-135 is a 3U single-height VMEbus enhanced storage module launched by XYCOM (now part of Acromag). It is an upgraded version of XVME-103, featuring enhanced support for large-capacity Flash, faster access speed, and more stable power-off protection. It is suitable for long-life industrial control, embedded systems, and demanding industrial VME platforms.
I. Model Positioning and Core Functionality
Positioning: 3U high-end storage module, an upgraded version of XVME-103, focusing on enhancing Flash capacity, read/write speed, and power stability, and compatible with all standard 3U VME enclosures and backplanes.
Core Functionality:
Large-capacity program storage: capable of handling large firmware, RTOS, and complex applications, prioritizing Flash (replacing EPROM), with fast erasing and long lifespan;
Critical data power-off protection: battery backup for RAM/Flash storage of process parameters, calibration data, and operation logs, permanently saved upon power loss;
Upgrade of old VME systems: directly replace XVME-100/103, no need to modify hardware or rewrite programs, achieving dual improvements in capacity and performance;
Military / Aviation high-reliability scenarios: wide temperature range, vibration resistance, long lifespan, meeting MIL-STD-810 standards.
II. Core Functional Characteristics
1. Standard 3U VMEbus interface, fully compatible
Complies with VMEbus IEEE 1014 (2.0/3.0), 3U single slot;
A24 address space, DTB slave device, compatible with all XYCOM series and third-party VME devices.
2. Dual storage groups, eight slots, large-capacity enhancement
2 groups (Bank1/Bank2) × 4 slots = 8 × 32-pin JEDEC;
Supported chips: CMOS RAM, EPROM, Flash (enhanced), EEPROM;
Maximum capacity: RAM 4MB, EPROM 8MB, Flash 8MB (XVME-103 is 4MB), EEPROM 4MB;
Speed: 50/100/150ns (XVME-103 minimum 100ns), compatible with high-speed timing;
Data width: 8/16 bits, supports RMW (read - modify - write).
3. Triple power-off protection, enhanced power supply monitoring
Built-in lithium battery: simultaneously backs up RAM and Flash configuration areas, seamless switching upon power loss;
Dual backup power sources: built-in battery or VME +5V STDBY (jumper selectable);
Undervoltage lockout: write operations disabled when +5V is below 4.75V, protecting data, self-check upon power-on and triggering BATT/FAIL alarms;
Battery low voltage indication: the BATT LED on the panel lights up when a battery replacement is needed.
4. Independent jumper configuration, flexible adaptation
Base address (A24), chip type / speed, backup power mode, write protection, SYSFAIL/SYSRESET linkage;
No need to modify hardware, jumper settings can adapt to different system planning.
5. Industrial-grade high reliability
Operating temperature: 0℃~+70℃ (XVME-103 is 65℃);
Storage temperature: -40℃~+85℃;
Vibration resistance: 1g (10–100Hz); shock resistance: 15g;
EMC: CE/FCC Class A, gold-plated gold fingers, shielding design;
Power consumption: +5V@1A (typical 5W), low heat generation.
6. Panel LED status indication
POWER: normal power always on;
BATT: battery low voltage alarm;
FAIL: power / battery / storage failure;
Bank1/Bank2 ACT: read/write flashing.
III. Hardware Specifications Overview
Bus and Interface
Standard: VMEbus IEEE 1014 (2.0/3.0)
Address: A24 (16MB)
Data width: 8/16 bits
Slots: 8×32-pin JEDEC, 2 independent
Storage Configuration Support: RAM, EPROM, Flash, EEPROM
Maximum capacity: RAM 4MB; EPROM 8MB; Flash 8MB; EEPROM 4MB
Speed: 50/100/150ns (cable)
Backup: Lithium battery / STDBY (optional)
Electrical / Environmental
Power supply: +5V DC ±5%, 1A (5W)
Operating temperature: 0℃~+70℃
Size: 3U (100×160mm), single slot
Weight: Approximately 0.35kg
IV. Key Differences (Upgrade Points) from XVME-103
Flash capacity: XVME-135 8MB; XVME-103 4MB
Access speed: XVME-135 minimum 50ns; XVME-103 minimum 100ns
Upper limit of operating temperature: XVME-135 70℃; XVME-103 65℃
Power stability: Enhanced monitoring, more reliable power-off protection for Flash configuration area
V. Application scenarios
Semiconductor / Industrial robots: 8MB Flash stores large firmware, high-speed read/write, reduces downtime;
Power / Chemical industry: Battery backup for storing process parameters and logs, no loss in power-off, traceable compliance;
Military / Aviation: Wide temperature range, shock resistance, long lifespan, suitable for onboard / radar / navigation control;
Upgrade of old VME: Replace XVME-100/103, capacity doubles, speed increases, lifespan extends.
VI. Installation and maintenance key points Installation
Case / Backplate Preparation: Confirm normal +5V and STDBY voltages;
Jumper Settings: Base address, chip speed, backup power mode;
Chip Installation: Insert in the specified direction to ensure good contact;
Board Insertion and Fixation; Power-on Self-Test: POWER light is constantly on, BATT light is off, FAIL light is off, read/write test is normal. Maintenance
Cleaning: Power off every 3 months to clean the circuit boards and gold fingers;
Battery: Check the BATT LED every 1 year. Replace with lithium battery if the voltage is low;
Configuration / Chips: Regularly check the jumpers and chips to prevent loosening / oxidation.
VII. Core Advantages
XVME-135 is the performance optimization for 3U VME storage: 8MB Flash, 50ns high speed, 70℃ wide temperature range, triple power-off protection, compatible with XVME-103. It addresses the pain points of traditional modules with small capacity, slow speed, and unstable high temperatures, has sufficient spare parts, high cost performance, and is suitable for building high-end VME systems and upgrading old equipment.
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