JANCD-G1R01
May 25, 2026

JANCD-G1R01

JANCD-G1R01 (YASNAC 2000G/3000G series remote I/O/communication board of Yaskawa) Product Overview JANCD-G1R01 is a remote I/O and communication interface board for the YASNAC 2000G/3000G numerical control system of AWC. It belongs to the system expansion type of boards. It is used for data interaction between the main control system (G1001B/G1002) and remote devices, external I/O units, and third-party communication devices, achieving remote signal acquisition/output, expansion of bus communication, and device networking functions. It adopts a 3U plug-in structure and works together with the backplane bus and CPU, graphics board, and power board to adapt to the I/O expansion and networking transformation of CNC lathes, machining centers, and older dedicated machines.

Description

Technical Specifications

Power Supply: Backplane bus, DC24V ±10%, power consumption approximately 18W

Communication Interface: Built-in remote I/O bus, RS-232/422/485, I/O expansion interface

I/O Capacity: Supports expansion of up to 64 input points / 64 output points (remote module)

Transmission Distance: Maximum 200m for remote bus (twisted-pair shielded wire)

Environment: Operating temperature 0–55℃, storage temperature -20–70℃, humidity 10%–90% (no condensation)

Structure: 3U standard board card, metal shielding enclosure, weight approximately 0.5kg

Installation and Wiring

Vertically installed in the 3U vacant slot of the control cabinet, leaving ≥50mm space for heat dissipation on top and bottom, and locking with screws to prevent vibration. The metal enclosure is reliably connected to the cabinet ground (ground resistance ≤ 4Ω).

Internal: Power supply and system communication are automatically completed by the backplane bus, without internal strong current wiring.

External: Only connect remote I/O modules, communication serial ports, external I/O terminals, etc. for low-voltage signals; single-ended grounding of the shielded wire, separation of strong and weak current wiring, spacing ≥ 10cm; remote bus uses dedicated twisted-pair wire, connector firmly pressed.

Maintenance and Care

Daily observation of the power supply, communication, and fault indicator light status of the board; no bulging, burning, or peculiar smell on the board surface.

Quarterly: Use low-pressure dry compressed air to blow dust from the board and slots, maintaining good heat dissipation.

Every six months: Check the tightness of all plugs, terminals, capacitors, and solder joints, no aging or leakage of liquids; retest the continuity of grounding.

Long-term shutdown: Cut off the power supply, take precautions against dust and moisture; preheat for 30 minutes with no external equipment connected before restarting.

Fault Troubleshooting

No power indicator: Backplane DC24V power supply abnormal, board card fuse blown, power chip damaged; measure the bus voltage, check the fuse, replace the board card for testing.

Communication interruption (light does not flash): Bus interface loose, communication chip failure, remote module power-off; reinsert the plug, measure the interface signal, and troubleshoot the remote power supply.

No response from I/O signals: I/O terminal loose, optocoupler damaged, remote module failure; check the wiring, measure the signal level, and replace the module.

Data packet loss / error code: Poor shielding, interference from strong and weak current, unstable grounding; optimize wiring, reinforce grounding, replace the shielded wire.

Random error and system crash: Virtual soldering of chips, oxidation of slots, excessive interference; clean the slot, reinsert and pull out, replace the board card for verification.


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