PXIE-5632
Description
Model Nomenclature
PXIe: PXI Express high‑speed modular instrumentation bus.
56: NI PXI RF and IF test instrument series.
32: 2‑port, 8.5 GHz, three‑slot, dual‑source vector network analyzer supporting full S‑parameters and frequency‑offset measurementsNI.
Technical Specifications
Form Factor: 3U three‑slot PXIe module.
Ports: 2 (PORT1/PORT2, 50 Ω, K‑type or N‑type connectors).
Frequency Range: 300 kHz to 8.5 GHz; 10 Hz resolution.
Dynamic Range: >110 dB (typical).
Noise Floor: <‑120 dBm/Hz.
Source Power: ‑30 dBm to +15 dBm; 0.01 dB step.
Sweep Speed: <500 μs/point (3,201 points).
IF Bandwidth: 10 Hz to 500 kHz (independently adjustable).
Reference Clock: External 10 MHz (SMA); internal optional.
Trigger: PFI 0 (SMA, 3.3 V TTL), low‑latency trigger.
Operating Temperature: 0 °C to 55 °C; Storage: ‑40 °C to 70 °C.
Optional Feature: Time Domain Analysis (TDR/TDT), part number 782299‑02.
Interface and Communication Configuration
Bus: PXIe Gen1 x1, supporting high‑speed DMA and peer‑to‑peer data streaming.
Drivers: NI‑VNA, IVI‑COM; compatible with LabVIEW, C/C++, Python, .NET.
Software: NI‑MAX (configuration/calibration), NI‑VNA Soft Front Panel (interactive control).
Synchronization: PXI trigger bus, star trigger, NI‑TClk for multi‑module phase synchronization.
Calibration: Supports SOLT, TRL, LRM, automatic precision calibration, and reference plane extensionNI.
Core Features
Full Vector S‑Parameter Measurement: Precise S11, S12, S21, S22 acquisition with amplitude, phase, and impedance data.
Dual‑Source & Frequency Offset Capability: Enables testing of mixers, converters, and other frequency‑translation devices.
Pulsed S‑Parameter Measurement: Low‑latency trigger and source access loops support pulsed RF characterization.
Wide Dynamic Range & Low Noise: Ensures stable measurement of weak signals and high‑isolation components.
Automated Precision Calibration: Built‑in routines minimize manual errors and maintain long‑term accuracyNI.
Application Scenarios
RF Component Test: S‑parameter and linear characterization of filters, amplifiers, mixers, antennas, cables, and connectors.
Wireless Communication: R&D and production test of 5G/6G front‑end modules, transceivers, and MIMO components.
Aerospace and Defense: Phase/amplitude consistency test of radar components, RF links, and electronic warfare modules.
Semiconductor Test: Impedance matching and insertion loss characterization of RF chips, packages, and substrates.
General‑Purpose Test: Dielectric constant measurement of materials, signal integrity analysis, and RF system integration validationNI.
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