Model Nomenclature

• PXIe: PXI Express bus

• 25: Switch/matrix series

• 31: 512‑crosspoint, 1‑wire matrix, reed relays, 60 V / 0.5 A rating

Technical Specifications

• Form factor: 3U, 1‑slot PXIe (hybrid/peripheral slots only)

• Crosspoints: 512 (1‑wire)

• Topologies: 4×128, 8×64, 2‑bank 4×64, 2‑bank 8×32 (all 1‑wire)

• Relay type: Reed, rhodium contactsNI

• Max switching voltage: 60 VDC, 30 VAC RMS

• Max switching current: 0.5 A DC

• Bandwidth: 10 MHz

• Scan rate: 2,000 cycles/s

• On‑resistance: Typical <2 Ω

• Relay life: >10⁷ operations (rated)

• Operating temp: 0 °C to 55 °C; storage: −20 °C to 70 °C

• Power: 10 W (+5 V), 2 W (+3.3 V)NI

• Max simultaneous relays: 64NI

Interface and Communication

• Front panel: 2×150‑pin Samtec ERM8 series connectors for matrix I/ONI

• Bus: PXIe Gen1, triggers 0–7 for multi‑module sync

• Trigger: Hardware input, min pulse width 150 ns

• Software: NI‑MAX configurable; LabVIEW/CVI/C++ APIs; NI‑SWITCH / Switch Executive supported

Core Features

• Ultra‑high density: 512 crosspoints in one slot, 1‑wire for high‑channel signal routing

• Multi‑topology flexibility: Software‑selectable 4×128 / 8×64 / 2‑bank configurations

• High‑speed reed relays: 2,000 cycles/s scan rate for fast test sequences

• Low power & long life: Reed relays consume less power and offer >10⁷ operations

• Relay health monitoring: Onboard counter for predictive maintenance

• Deterministic triggering: Hardware triggers ensure precise, repeatable switching

Application Scenarios

• Semiconductor parametric test (high‑channel, low‑voltage)

• Aerospace/defense high‑density signal routing

• Industrial sensor and low‑power device validation

• Automotive ECU and distributed I/O testing

• High‑channel‑count data acquisition systems

Usage and Maintenance

Installation

Operation

Maintenance