June 08, 2026

Product Specification: B&R 5PC600.X855-03 CPU Motherboard

The 5PC600.X855-03 is a high-performance industrial CPU motherboard designed exclusively for the B&R Automation PC 620 (APC620) series, serving as the core control and computing unit for complex industrial automation applications. Engineered with an upgraded Intel Pentium M processor and industrial-grade 855GME chipset, it delivers enhanced computational power, improved graphics performance, and extended environmental resilience compared to lower-tier 5PC600.X855-00/01 variants. Optimized for 24/7 continuous operation in harsh factory, process, and machinery environments, it functions as a critical original and replacement component for APC620 systems, balancing robust performance, long-term lifecycle support, and seamless integration with B&R automation ecosystems.

Description

Product Specification: B&R 5PC600.X855-03 CPU Motherboard

1. Product Overview

2. Basic Product Information

Manufacturer and Model Identity

Manufacturer: B&R Industrial Automation. Model: 5PC600.X855-03. Alternative reference: 5PC600X85503. Description: CPU board with Intel Pentium M 1.8 GHz, 400 MHz PSB, 2 MB L2 cache, 855GME chipset, 1×SO-DIMM DDR slot, for APC620 series. Product type: Industrial CPU motherboard, core control board for APC620 IPC, 5PC series.

Core System Specifications

Processor: Intel Pentium M (Banias core, 0.13μm process), 1800 MHz core frequency, 400 MHz PSB (Processor System Bus), 2 MB L2 cache (double the capacity of 01 variant), low-power design (core voltage 1.35 V), supports MMX and SSE2 instruction sets.
Chipset: Intel 82855GME (GMHC) northbridge + Intel 82801DB (ICH4) southbridge, industrial-grade, long-term lifecycle support, optimized for low power, stability, and extended temperature operation.
Memory: 1×184-pin SO-DIMM DDR slot, supports up to 1 GB DDR SDRAM (333 MHz, PC2700, non-ECC), 2.5 V memory voltage, compatible with B&R 5MMDDR series modules.
Graphics: Integrated Intel Extreme Graphics 2 (embedded in 855GME chipset), up to 64 MB shared memory, max 32-bit color depth, supports DVI-I/Smart Display Link and LVDS display outputs, enhanced driver optimization for industrial HMI visualization.
Storage Interfaces: 2×IDE (UDMA 100) ports for HDD/SSD, supports CompactFlash (CF) card via adapter, compatible with industrial storage devices, enhanced signal integrity for high-vibration environments.
Expansion Slots: 1×AP Link slot for B&R Automation Panel connection, compatible with APC620 chassis PCI expansion, supports plug-and-play integration with APC620 touch screens (5PC600.X855-02).
BIOS: AMI BIOS, version X855GME 1.20 (released 08/05/2013), supports system configuration, hardware monitoring, boot management, and remote diagnostics, with enhanced compatibility for modern industrial OS.

Electrical Characteristics

Power Supply: 24 V DC ±20% (18–30 V DC, industrial wide-range input), compatible with APC620 system power distribution, reverse polarity protection included.
Power Consumption: 20–24 W (typical, full load with CPU, memory, and integrated graphics), slightly higher than 01 variant due to upgraded CPU, with optimized power management for energy efficiency.
Protection Features: Overvoltage, undervoltage, short-circuit protection; ESD protection on all I/O ports; overcurrent protection for CPU and memory circuits; surge protection for power inputs; enhanced transient voltage suppression for harsh electrical environments.
Battery: Onboard 3 V lithium battery (compatible with model 0AC201.9) for RTC (real-time clock) and BIOS parameter retention, 2.5-year service life, with low-battery monitoring via BIOS.
Voltage Regulation: Onboard isolated DC/DC converters generate 1.35 V (CPU), 2.5 V (memory), 3.3 V (I/O), 5 V (peripherals) for stable power distribution, with improved ripple suppression for high-load operation.

Physical and Mechanical Properties

Dimensions: 185 mm (L) × 122 mm (W) × 20 mm (H) (half-size industrial motherboard, optimized for APC620 chassis).
Weight: Approximately 0.88 kg (bare board, no accessories), marginally heavier than 01 variant due to upgraded CPU components.
Construction: Industrial-grade PCB with anti-corrosion conformal coating, reinforced solder joints, and component retention clips for enhanced vibration resistance; extended temperature-rated capacitors and resistors for harsh environments.
Protection Rating: IP20 (board surface and components, dust and splash resistant when installed in APC620 chassis).
Vibration Resistance: 2–9 Hz (1.75 mm amplitude); 9–200 Hz (0.5 g continuous, EN 61131-2 compliant), with improved component anchoring for high-vibration machinery applications.
Shock Resistance: 20 g (11 ms pulse, operational; 30 g non-operational), enhanced over 01 variant for rugged deployment.
Mounting: Screw-mounted inside APC620 chassis, compatible with vertical/horizontal installation of the host system, with standardized mounting holes for easy replacement.

Environmental Limits

Operating Temperature: 0°C to +55°C (passive cooling, no fan required), extended by 5°C compared to 01 variant for high-temperature industrial environments; extends to +60°C with optional chassis fan kit.
Storage Temperature: -40°C to +75°C.
Relative Humidity: 10%–95% (non-condensing, operational/storage).
Pollution Degree: 2 (industrial environment per EN 61131-2).
Altitude: Up to 3,000 m (no performance derating; above 3,000 m, derate 1°C per 300 m).

Compliance and Certification

Compliant with EN 61131-2, EN 61000-6-2, EN 61000-6-4, EN 60950-1. Certifications: CE, UKCA, cULus, RoHS, REACH. 100% factory tested for functionality, thermal stability, vibration durability, and compatibility with APC620 chassis before delivery, with extended burn-in testing for high-reliability applications.

3. Core Functions and Product Positioning

Core Functions

Upgraded Industrial Computing: 1.8 GHz Pentium M processor and 2 MB L2 cache deliver 12.5% higher clock speed and double the cache capacity compared to 01 variant, supporting complex control algorithms, multi-tasking, and data-intensive applications with faster processing and reduced latency.
Integrated High-Performance Graphics: Intel Extreme Graphics 2 supports high-resolution display outputs (DVI-I/LVDS) for HMI, industrial monitoring, and visualization, with optimized drivers for smoother graphics rendering and improved compatibility with B&R HMI software.
Flexible and Redundant Storage Support: Dual IDE ports and CompactFlash compatibility enable diverse storage configurations (HDD/SSD/CF) for data storage, system booting, and optional redundancy for critical data protection, with enhanced stability in high-vibration environments.
Rich Native I/O Connectivity: Onboard 2×USB 2.0, 2×RS232, 1×Gigabit Ethernet, PS/2 combo port, and audio I/O for seamless integration with peripherals, sensors, and industrial networks, with improved ESD protection for all ports.
Reliable System Maintenance & Recovery: Hardware watchdog timer for automatic system recovery in case of crashes; onboard battery for RTC/BIOS retention; tool-less memory and storage replacement for easy maintenance; BIOS supports remote configuration and diagnostics, with enhanced error logging for troubleshooting.
Seamless APC620 Platform Compatibility: Designed exclusively for APC620 series chassis, supporting all expansion slots, I/O interfaces, and power supply specifications of the host system for plug-and-play integration, fully compatible with APC620 touch screens (5PC600.X855-02) and system units (5PC600.SX05-00/01).

Operational Features

Designed for 24/7 continuous operation in harsh industrial environments. The low-power CPU and fanless design eliminate mechanical failure points, while industrial-grade components ensure a mean time between failures (MTBF) of >200,000 hours at 25°C. The board supports B&R Automation Studio for system configuration, programming, and diagnostics, enabling seamless integration with B&R automation ecosystems and supporting real-time operating systems for motion control and process automation. The upgraded CPU and cache deliver improved performance for multi-axis motion control, complex HMI visualization, and data logging applications.

Product Positioning

A high-performance industrial CPU motherboard for the B&R APC620 platform, the 5PC600.X855-03 targets medium-to-high complexity industrial control applications requiring enhanced processing power, extended temperature resilience, and long-term reliability. It serves as a critical component for APC620 systems deployed in factory automation, multi-axis motion control, process control, and integrated HMI systems. It is ideal for upgrading existing APC620 systems with lower-speed CPUs (00/01 variants) and for new builds requiring robust performance in high-temperature or high-vibration industrial environments, without the cost of high-end multi-core solutions.

4. Core Performance Parameters

Computing Performance

CPU Frequency: 1800 MHz (Pentium M).
Cache: 2 MB L2 cache, 32 KB L1 instruction cache, 32 KB L1 data cache.
Memory: Up to 1 GB DDR (333 MHz, PC2700).
Chipset: Intel 82855GME + ICH4 (industrial-grade).
Instruction Sets: MMX, SSE2.

Graphics & Display Performance

GPU: Intel Extreme Graphics 2 (integrated).
Shared Memory: Up to 64 MB.
Max Resolution: 1920×1200 (DVI-I, 60 Hz).
Color Depth: Up to 32-bit.
Display Outputs: DVI-I/Smart Display Link, LVDS.

Storage & Interface Performance

Storage Ports: 2×IDE (UDMA 100), CompactFlash compatible.
Ethernet: 1×Gigabit Ethernet (10/100/1000 Mbps, IEEE 802.3).
USB: 2×2.0 (480 Mb/s).
Serial: 2×RS232 (DB9, 115.2 kbps max).
Expansion: 1×AP Link slot, compatible with APC620 PCI slots.

Reliability & Environmental Performance

MTBF: >200,000 hours (25°C, bare board).
Operating Temperature: 0°C to +55°C (passive cooling).
Power Consumption: 20–24 W (typical full load).
Battery Life: 2.5 years (RTC/BIOS battery).
Lifecycle: 10 years (industrial component availability).

5. General Matching Accessories and Compatible Devices

Compatible Hardware

Memory: 184-pin SO-DIMM DDR (333 MHz, PC2700, up to 1 GB, non-ECC), compatible with B&R 5MMDDR series modules.
Storage: 2.5” IDE HDD/SSD (industrial-grade), CompactFlash (CF) cards (via IDE adapter).
Replacement Parts: 3 V lithium battery (0AC201.9), BIOS upgrade chip (X855GME v1.20), thermal paste, anti-static gloves, conformal coating kit.
Cooling: Passive heat sink (standard), optional chassis fan kit (for high-temperature environments or continuous high-load operation).
Cables: IDE cables, USB cables, serial cables, DVI-I/LVDS display cables, AP Link cables, power cables.

Compatible Systems & Software

Host Chassis: B&R APC620 series (5PC600.SX01-00, 5PC600.SX02-00, 5PC600.SX05-00, 5PC600.SX05-01).
HMI Touch Screens: B&R 5PC600.X855-02 (APC620 dedicated touch screen).
Operating Systems: Windows XP Embedded, Windows 7, Windows 10 IoT Enterprise, Linux (real-time variants like RTOS, LinuxCNC).
Software: B&R Automation Studio (configuration/programming/diagnostics), BIOS upgrade tool (X855GME v1.20), system monitoring software, thermal management tools.

Installation & Maintenance Tools

Tools: Phillips screwdriver, anti-static ESD mat, thermal paste applicator, cable tie set.
Cleaning Kit: Soft brush, compressed air (for PCB and connector cleaning), contact cleaner (for I/O ports and expansion slots).

6. Application Scope and Usage Notes

Application Scope

Factory Automation: Complex assembly lines, multi-axis motion control stations, centralized HMI and monitoring systems, material handling systems (automated conveyors, AGVs), high-speed packaging machinery.
Process Automation: Medium-to-large scale water treatment plants, pharmaceutical production lines (batch processing, packaging), food & beverage processing lines (dairy, beverage, bakery), medium-scale chemical processing facilities, energy management systems (power distribution, monitoring).
Machinery Automation: Textile machinery (multi-axis looms, knitting machines), plastic processing machinery (injection molders, extruders), woodworking CNC machines, metalworking equipment (lathes, mills, grinders), printing and paper processing machinery.
Industrial HMI & Monitoring: Industrial display systems, data acquisition stations, remote monitoring terminals, machine vision integration (medium processing load), building automation (HVAC, access control for industrial facilities).

Usage Notes

This CPU motherboard is exclusively designed for B&R APC620 series chassis; it is incompatible with other B&R IPC models (e.g., APC810, APC910) or third-party industrial chassis. When installing the board, strictly follow anti-static procedures (use ESD mat and gloves) to avoid electrostatic damage to sensitive components. Ensure all power and data cables are securely connected to prevent loose contacts, voltage drops, and system instability. The onboard battery must be replaced every 2.5 years to maintain RTC accuracy and BIOS settings; use only the specified 3 V lithium battery (0AC201.9) to avoid compatibility issues. Do not install non-compatible memory modules (e.g., DDR2/DDR3, ECC) as this may cause system boot failure, memory errors, or damage to the board. Regularly clean the board, I/O ports, and expansion slots every 3–6 months based on on-site environmental conditions to prevent dust accumulation, corrosion, and poor electrical contact. For ambient temperatures above 50°C or continuous high-load operation (e.g., all PCI slots in use, complex motion control tasks), install the optional chassis fan kit to enhance thermal dissipation, prevent overheating, and ensure long-term reliability.

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