General Information

• Part Number: 01KS504852B-EA

• Manufacturer: Applied Materials

• Product Type: Semiconductor equipment special sealing assembly

• Usage Scene: Wafer chamber internal sealing, gas circuit sealing, vacuum sealing

• Application: Matched with AMAT semiconductor process chamber unit

Material Characteristic

• Main Material: High purity fluorine rubber / Kalrez

• Hardness: Shore A 75±5

• Working Medium: Process gas, inert gas, vacuum environment

• Outgassing Grade: Ultra-low outgassing, cleanroom grade

• Heat Resistance: Stable under high temperature process environment

Performance Parameters

• Working Pressure Range: Atmospheric pressure to high vacuum

• Working Temperature: -20℃ ~ 220℃

• Compression Set: ≤15%

• Chemical Resistance: Resist most etching gas and process solvent

• Service Life: Long cycle service for continuous production

Installation & Mechanical

• Structure Type: Special shaped sealing ring assembly

• Installation Mode: Embedded groove fixed installation

• Assembly Feature: Precise size, easy on-site replacement

• Dimension: Original factory standard matching size

Environmental Standard

• Storage Temperature: -30℃ ~ 70℃

• Storage Humidity: 10%~85% RH, non-condensing

• Industry Compliance: Meet semiconductor fab clean grade standard

• Feature: Dust-free packaging, anti-aging, corrosion resistant

Main Features

1. Excellent vacuum sealing performance, no air leakage

2. High temperature resistant, suitable for process heating environment

3. Ultra low particle release, will not pollute wafer surface

4. Original equipment matching part, fully interchangeable

5. Stable performance, reduce equipment maintenance downtime