017-0266-01
May 21, 2026

017-0266-01

Part Number: 017-0266-01 Manufacturer: Brooks Automation (USA) Product Type: Vacuum Wafer Transfer Robot(4‑axis) Model: Reliance ATR8 Application: Semiconductor wafer handling in vacuum environments Compatibility: 200 mm / 300 mm wafer systems, Brooks CHE 146828 controller

Description

General Information

  • Part Number: 017-0266-01

  • Manufacturer: Brooks Automation (USA)

  • Product Type: Vacuum Wafer Transfer Robot(4‑axis)

  • Model: Reliance ATR8

  • Application: Semiconductor wafer handling in vacuum environments

  • Compatibility: 200 mm / 300 mm wafer systems, Brooks CHE 146828 controller

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Mechanical Specifications

  • Axes: 4(θ, Z, R, End effector)

  • Payload: 0.5 kg(max wafer weight)

  • Reach:

    • Horizontal: 800 mm(max)

    • Vertical (Z‑axis): 600 mm(travel)

  • Repeatability: ±0.05 mm(position);±0.01°(rotation)

  • Drive System: Brushless servo motors, direct‑drive rotary joints

  • End Effector: Vacuum paddle(standard);fork type optional

  • Dimensions (W×H×D): 450 × 1,200 × 450 mm

  • Weight: 118 kg(robot only);260 lbs(shipping)

  • Mounting: Floor‑standing, base‑mounted

Electrical & Vacuum Specifications

  • Power Supply: 208–240 VAC, 50/60 Hz, 3‑phase, 2 kVA

  • Control Interface: Serial (RS‑232/485) + discrete I/O

  • Vacuum Rating: 1×10⁻⁷ Torr(ultra‑high vacuum compatible)

  • Pressure Range: Atmospheric to UHV(bakeable to 120 °C)

  • Communication: Brooks proprietary protocol, Ethernet optional

Environmental Ratings

  • Operating Temp: 10 °C to 40 °C(ambient);0 °C to 50 °C(internal)

  • Storage Temp: −20 °C to 60 °C

  • Humidity: 20%–80% RH, non‑condensing

  • Vibration: 0.5 g, 10–100 Hz(operating)

  • Cleanliness: Class 1(ISO 14644‑1)ultra‑clean compatible

  • RoHS: Compliant(2011/65/EU)

Key Features

  • UHV‑compatible design: All metal seals, non‑outgassing materials

  • High‑speed wafer transfer: Cycle time < 3 seconds(200 mm wafer)

  • Precision positioning: Direct‑drive motors with 23‑bit encoders

  • Compact footprint: Optimized for semiconductor fab layout efficiency

  • Long‑term reliability: MTBF > 100,000 hours;designed for 24/7 operation


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