PCI-7833R
Description
Main technical parameters (reduced)
1. FPGA core
Model: Virtex-II XC2V3000 (3M logic gates)
Resources: Approximately 30,720 flip-flops, 96×18×18 multipliers, 1.728 Mbit block RAM
Development: LabVIEW FPGA graphical programming, hardware direct execution
2. Analog input AI (8 channels)
Resolution: 16 bits
Range: ±10 V
Sampling rate: Up to 200 kS/s per channel (independent)
Synchronization: Multi-channel synchronous sampling, hardware triggering
3. Analog output AO (8 channels)
Resolution: 16 bits
Range: ±10 V
Update rate: Up to 1 MHz per channel (independent)
Drive: Direct drive of ±10 V load, short-circuit protection
4. Digital I/O DIO (96 channels)
Channel count: 96 bidirectional DIO (each channel independently configurable)
Rate: Up to 40 MHz (hardware timing)
Functions: TTL input/output, 32-bit counter, PWM, encoder (A/B/Z), custom protocol (SPI/UART, etc.)
Isolation: I/O isolated from chassis 2500 Vrms
5. Synchronization and storage
Synchronization bus: RTSI (multi-card synchronization, 25 ns accuracy)
On-board cache: 190 KB FIFO, supports DMA streaming data
Expansion: Can be connected to 2 NI 9151 expansion chassis to increase signal conditioning and I/O quantity
6. Electrical and environmental
Power supply: +3.3 V @ 1.2 A; +5 V @ 15 mA
Power consumption: Approximately 4 W
Operating temperature: 0 - 55 °C (standard)
Size: Standard half-length PCI (170 × 109 mm)
7. Typical Applications
Hardware-in-the-Loop (HIL) testing: ECU simulation, control algorithm verification
High-speed control: Motion control, power control, servo drive
Precise signal generation / acquisition: Arbitrary waveform, sensor simulation, dynamic testing
Industrial automation: High-speed I/O, timing control, protocol conversion
Mixed-signal system: Analog + digital synchronous real-time processing










Get a Quote