SCHNEIDER AS-B801-000 (Modicon 800/984 Series Filler Module)
Description
Model Definition
AS: Modicon Automation System component
B801: Single-slot filler module for 800-series racks
000: Standard version, no additional features
Technical Specifications
Type: Empty slot filler plate
Compatibility: Modicon 800, 984, and 300-series backplanes (8/11-slot)
Material: Industrial-grade plastic, flame-retardant
Dimensions: 125 × 90 × 75 mm (W×H×D, same as standard I/O modules)
Weight: Approx. 0.33 kg (0.73 lbs)
Color: Gray (matches Modicon rack design)
Protection Class: IP20
Operating Temperature: 0°C to +60°C
Storage Temperature: −40°C to +70°C
Interface & Configuration
Mounting: Direct insertion into standard Modicon 800/984 rack slots
Backplane: Matches 984-series I/O bus profile (no electrical connection)
Installation Tool: None required (push-fit)
Core Functions
Slot Occupancy: Covers unused slots to prevent dust/debris ingress
Airflow Optimization: Maintains consistent cooling airflow across the rack
Structural Support: Preserves rack rigidity and module alignment
Backplane Protection: Shields unused backplane connectors from damage
Application Scenarios
Systems: Modicon 800, 984, 300-series PLC racks
Industries: Process control, manufacturing, automation, legacy system maintenance
Use Cases: Unused slot blanking, rack aesthetics, environmental protection
Compatibility
Racks: Modicon 800-series, 984-series, 300-series 8/11-slot backplanes
Module Family: Interchangeable with AS-B802-000 (dual-slot) and other B80x filler modules
Status
Discontinued: Obsolete, no longer manufactured
Availability: New surplus, refurbished, or used units with 1–2 year warranty
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